TLX-8 PCB 2-Layer 10mil Substrate ENIG Finish for RF Applications

Introduction to TLX-8 Material

TLX-8 is a high-volume antenna material composed of PTFE fiberglass laminates, specifically designed for reliable performance in a broad range of RF applications. Its versatility comes from various thickness options and copper cladding types, making it ideal for low layer count microwave designs. TLX-8 demonstrates mechanical reinforcement in severe environments, including:

- High vibration during space launches

- High temperature exposure in engine modules

- Radiation resistance for space applications

- Extreme conditions at sea for naval antennas

- Wide temperature ranges for altimeter substrates during flight

PCB Stack-up

The stackup of the PCB consists of:

- Copper Layer 1: 35 μm

- Taconic TLX-8 Core: 0.254 mm (10 mil)

- Copper Layer 2: 35 μm

PCB Details

Quality Standards and Availability

This PCB adheres to IPC-Class-2 quality standards and is available for purchase worldwide.

Benefits of TLX-8 PCBs

- Excellent PIM Values: Measured below -160 dBc

- Mechanical & Thermal Properties: Outstanding performance in challenging environments

- Low and Stable Dielectric Constant (Dk): Provides consistent electrical performance

- Dimensionally Stable: Maintains form factor under various conditions

- Low Moisture Absorption: Enhances durability and reliability

- Tightly Controlled Dk: Ensures predictable performance

- Low Dissipation Factor (DF): Minimizes signal loss

- UL 94 V0 Rating: High flammability resistance

- Ideal for Low Layer Count Microwave Designs: Perfect for advanced RF applications

Electrical Properties

- Dielectric Constant @ 10 GHz: 2.55 ± 0.04

- Dissipation Factor @ 10 GHz: 0.0018

- Surface Resistivity (Elevated Temp): 6.605 x 10^8 Mohm

- Surface Resistivity (Humidity Conditions): 3.550 x 10^6 Mohm

- Volume Resistivity (Elevated Temp): 1.110 x 10^10 Mohm/cm

- Volume Resistivity (Humidity Conditions): 1.046 x 10^10 Mohm/cm

Dimensional Stability

- MD After Bake: 0.06 mm/M

- CD After Bake: 0.08 mm/M

- MD Thermal Stress: 0.09 mm/M

- CD Thermal Stress: 0.10 mm/M

Coefficient of Thermal Expansion (CTE)

- X: 21 ppm/°C

- Y: 23 ppm/°C

- Z: 215 ppm/°C

Thermal Properties

- 2% Weight Loss: 535 °C

- 5% Weight Loss: 553 °C

Chemical and Physical Properties

- Moisture Absorption: 0.02%

- Dielectric Breakdown: > 45 kV

- Flammability Rating: V-0

Typical Applications

TLX-8 PCBs are suited for various applications, including:

- Radar systems

- Mobile communications

- Microwave test equipment

- Microwave transmission devices

- Couplers, splitters, combiners, amplifiers, and antennas

With its robust construction and exceptional properties, TLX-8 is the material of choice for high-performance PCBs in demanding RF environments.