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RT Duroid 5880 PCB 3 Layer 3.3mm Thick Immersion Gold Finish

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

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Ms.Ivy Deng
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RT Duroid 5880 PCB 3 Layer 3.3mm Thick Immersion Gold Finish

Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin China
Minimum Order Quantity 1PCS
Price USD9.99-99.99/PCS
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
PCB material RT/duroid 5880 - 1.575 mm (62mil)
Layer count 3-layer
PCB thickness 3.3mm
PCB size 49.1mm x 43.2 mm=1PCS, +/- 0.15mm
Copper weight 1oz (1.4 mils) outer layers/inner layers
Surface finish Immersion Gold
Detailed Product Description

This PCB is built using RT/duroid 5880 and RO4450F, both of which are renowned for their superior electrical properties.

 

- RT/duroid 5880 is a high-frequency laminate composed of PTFE (Polytetrafluoroethylene) reinforced with glass microfibers. Its dielectric constant remains uniform across various frequencies, making it ideal for applications that demand consistent performance.

 

- RO4450F is used as a bonding ply, providing additional strength and thermal stability to the PCB structure.

 

Key Specifications
- Dimensions: 49.1mm x 43.2mm (±0.15mm)
- Layer Count: 3 layers
- Minimum Trace/Space: 5/7 mils
- Minimum Hole Size: 0.4mm
- Finished Board Thickness: 3.3mm
- Finished Copper Weight: 1oz (1.4 mils) on both outer and inner layers
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Gold
- Testing: 100% electrical testing is conducted prior to shipment to ensure quality and reliability.

 

Advantages of RT/duroid 5880

The use of RT/duroid 5880 offers numerous advantages:

 

- Uniform Electrical Properties: The dielectric constant of RT/duroid 5880 is tightly controlled, with a typical value of 2.2 (±0.02 at 10 GHz). This consistency is crucial for high-frequency applications.

 

- Low Dissipation Factor: At 10 GHz, the dissipation factor is an impressive 0.0009, minimizing signal loss and enhancing overall performance.

 

- Resistance to Environmental Factors: The material is resistant to solvents and reagents, making it suitable for various manufacturing processes.

 

- Thermal Stability: With a low temperature coefficient of dielectric constant (TCDk) of -125 ppm/°C, this PCB can maintain performance across a wide temperature range.

 

RT/duroid 5880 Typical Value
PropertyRT/duroid 5880DirectionUnitsConditionTest Method
Dielectric Constant,εProcess2.20
2.20±0.02 spec.
ZN/AC24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign2.2ZN/A8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0004
0.0009
ZN/AC24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε-125Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
Volume Resistivity2 x 107ZMohm cmC/96/35/90ASTM D 257
Surface Resistivity3 x 107ZMohmC/96/35/90ASTM D 257
Specific Heat0.96(0.23)N/Aj/g/k
(cal/g/c)
N/ACalculated
Tensile ModulusTest at 23℃Test at 100℃N/AMPa(kpsi)AASTM D 638
1070(156)450(65)X
860(125)380(55)Y
Ultimate Stress29(4.2)20(2.9)X
27(3.9)18(2.6)Y
Ultimate Strain67.2X%
4.95.8Y
Compressive Modulus710(103)500(73)XMPa(kpsi)AASTM D 695
710(103)500(73)Y
940(136)670(97)Z
Ultimate Stress27(3.9)22(3.2)X
29(5.3)21(3.1)Y
52(7.5)43(6.3)Z
Ultimate Strain8.58.4X%
7.77.8Y
12.517.6Z
Moisture Absorption0.02N/A%0.62"(1.6mm) D48/50ASTM D 570
Thermal Conductivity0.2ZW/m/k80℃ASTM C 518
Coefficient of Thermal Expansion31
48
237
X
Y
Z
ppm/℃0-100℃IPC-TM-650 2.4.41
Td500N/A℃ TGAN/AASTM D 3850
Density2.2N/Agm/cm3N/AASTM D 792
Copper Peel31.2(5.5)N/APli(N/mm)1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
FlammabilityV-0N/AN/AN/AUL 94
Lead-free Process CompatibleYesN/AN/AN/AN/A

 

Applications

The versatility of this 3-layer rigid PCB makes it suitable for a wide range of applications, including:

 

- Commercial Airline Broadband Antennas: High reliability and performance in communication systems.
 

- Microstrip and Stripline Circuits: Ideal for RF and microwave applications.
 

- Millimeter Wave Applications: Supports advanced technologies in telecommunications and radar.
 

- Radar Systems: Critical for guidance systems and precision tracking.
 

- Point-to-Point Digital Radio Antennas: Ensures clear and reliable connections in communication networks.

 

 

Quality Assurance and Standards

Our manufacturing process adheres to IPC-Class-2 standards, ensuring that each PCB meets the highest quality benchmarks. The use of Gerber RS-274-X artwork facilitates precise production, and the implementation of 100% electrical testing prior to shipment guarantees that only fully functional boards reach our customers.

 

Conclusion
RT duroid 5880 PCB stands as a testament to advanced engineering and quality manufacturing. With its exceptional electrical properties, robust construction, and versatility across various applications, this PCB is an ideal choice for engineers and designers aiming for excellence in their electronic projects. As technology continues to evolve, we remain committed to providing solutions that meet the ever-changing needs of the industry.

 

Product Tags: RT duroid 5880 PCB   3 layer enig pcb   3.3mm Thick enig pcb  
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