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Double Sided PCB RT Duroid 6035HTC 60mil White Silkscreen Immersion Silver

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

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Ms.Ivy Deng
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Double Sided PCB RT Duroid 6035HTC 60mil White Silkscreen Immersion Silver

Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99/PCS
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
PCB Material RT/duroid 6035HTC - 1.524 mm (60mil)
Layer Count 2-layer
PCB Size 43mm x 107 mm=1PCS, +/- 0.15mm
PCB Thickness 1.6mm
Copper Weight 1oz (1.4 mils) inner/outer layers
Surface Finish Immersion Silver
Solder Mask No
Silkscreen White
Detailed Product Description

In the world of electronics, the choice of printed circuit board (PCB) material can significantly impact performance, especially in high-frequency and high-power applications. Our double-sided PCB constructed from RT/duroid 6035HTC stands out as a premier solution for engineers and designers seeking reliability, efficiency, and advanced functionality.

 

PCB Construction and Specifications

 

Base Material: RT/duroid 6035HTC

RT/duroid 6035HTC is a ceramic-filled PTFE composite renowned for its high thermal conductivity and excellent dielectric properties. This material is particularly suited for high-power RF and microwave applications, offering characteristics that surpass traditional laminates.

 

Detailed Specifications

- Layer Count: This PCB features a double-sided design, allowing for efficient routing of complex circuits in a compact footprint.
 

- Dimensions: Measuring 43mm x 107mm (± 0.15mm), this PCB is designed for versatility in various applications.
 

- Trace and Space Requirements: With a minimum trace/space of 4/7 mils, this PCB supports high-density designs without compromising signal integrity.
 

- Hole Size and Vias: The minimum hole size is 0.3mm, and the board includes 71 vias, enhancing connectivity without the complications of blind vias.
 

- Finishing Touches: The immersion silver surface finish provides excellent solderability and corrosion resistance, while the 100% electrical testing prior to shipment ensures reliability.

 

Layer Stackup

The stackup of this PCB consists of:

 

- Copper Layer 1: 35 μm
- RT/duroid 6035HTC Core: 1.524 mm (60 mils)
- Copper Layer 2: 35 μm

 

This configuration optimizes thermal management and electrical performance, ensuring robust operation in high-frequency applications.

 

RT/duroid 6035HTC Typical Value
PropertyRT/duorid 6035HTCDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.50±0.05Z 10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.6Z 8 GHz - 40 GHzDifferential Phase Length Method
Dissipation Factor0.0013Z 10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-66Zppm/℃-50 ℃to 150℃mod IPC-TM-650, 2.5.5.5
Volume Resistivity108 MΩ.cmAIPC-TM-650, 2.5.17.1
Surface Resistivity108 AIPC-TM-650, 2.5.17.1
Dimensional Stability-0.11 -0.08CMD MDmm/m (mils/inch)0.030" 1oz EDC foil Thickness after etch '+E4/105IPC-TM-650 2.4.39A
Tensile Modulus329 244MD CMDkpsi40 hrs @23℃/50RHASTM D638
Moisure Absorption0.06 %D24/23IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃)19 19 39X Y Zppm/℃23℃ / 50% RHIPC-TM-650 2.4.41
Thermal Conductivity1.44 W/m/k80℃ASTM C518
Density2.2 gm/cm323℃ASTM D792
Copper Peel Stength7.9 pli20 sec. @288 ℃IPC-TM-650 2.4.8
FlammabilityV-0   UL 94
Lead-Free Process CompatibleYes    

 

Performance Characteristics

 

Dielectric Properties

The PCB's dielectric constant (DK) of 3.5 ± 0.05 at 10 GHz and a low dissipation factor of 0.0013 means it can handle high-frequency signals with minimal loss. These properties are crucial for applications requiring precision and clarity in signal transmission.

 

Thermal Management

With a thermal conductivity of 1.44 W/m/K at 80°C, RT/duroid 6035HTC excels in heat dissipation. This capability is vital for high-power applications, where excessive heat can lead to performance degradation or failure. The high thermal stability ensures that the PCB maintains its integrity even under extreme conditions.

 

Coefficient of Thermal Expansion (CTE)

The CTE values—19 ppm/°C in the X and Y axes and 39 ppm/°C in the Z-axis—indicate the PCB's dimensional stability across temperature variations. This stability is essential for maintaining the reliability of connections and overall circuit performance.

 

Benefits of RT/duroid 6035HTC PCB

1. High Thermal Conductivity: Effective heat dissipation lowers operating temperatures, enhancing long-term reliability in demanding applications.
 

2. Excellent Dielectric Performance: Reduced insertion loss and superior signal integrity are achieved, making this PCB ideal for high-frequency circuits.
 

3. Robust Stability: The thermal stability of the material ensures consistent performance, even in challenging environments.

 

 

Applications

This double-sided PCB is tailored for a variety of demanding applications, including:

 

- High Power RF Amplifiers: Essential for telecommunications and broadcasting, where signal strength is paramount.
 

- Microwave Applications: Used in radar systems, satellite communications, and medical imaging.
 

- Power Dividers and Couplers: Critical for signal management in complex circuitry, ensuring efficient distribution of power.

 

Conclusion

The RT/duroid 6035HTC double-sided PCB is a top-tier solution for engineers and designers in need of high-performance, reliable circuit boards for advanced applications. With its exceptional thermal and electrical properties, this PCB not only meets but exceeds the rigorous demands of modern electronics.

 

For any inquiries or to discuss how our RT/duroid 6035HTC PCB can meet your specific needs, please contact our sales team. We are here to support your projects with expertise and high-quality solutions.

Product Tags: 60mil Double-Sided PCB   RT duroid 6035HTC Double-Sided PCB   Immersion Silver Double-Sided PCB  
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