Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled

Browse Categories

Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng View Contact Details

Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled

Brand Name	Bicheng
Certification	UL, ISO9001, IATF16949
Place of Origin	CHINA
Minimum Order Quantity	1PCS
Price	USD9.99-99.99/PCS
Payment Terms	T/T
Supply Ability	5000PCS per month
Delivery Time	8-9 working days
Packaging Details	Vacuum bags+Cartons
Material	RO4003C and FR-4
Layer count	6-layer
PCB size	83.50mm x 66mm=1PCS, +/- 0.15mm
PCB thickness	1.1mm
Copper weight	1oz (1.4 mils) inner/outer layers
Surface finish	Immersion Gold

Detailed Product Description

We are excited to announce our newly shipped 6-layer printed circuit board (PCB) designed with Rogers RO4003C materials. This innovative PCB combines exceptional electrical performance with manufacturing ease, making it a perfect solution for high-frequency applications.

Key Features

RO4003C Material

- Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
- Dissipation Factor: 0.0027 at 10 GHz
- Thermal Conductivity: 0.71 W/m/°K
- Thermal Coefficient of Dielectric Constant: +40 ppm/°C (operating range: -50°C to 150°C)
- CTE Matched to Copper:
- X axis: 11 ppm/°C
- Y axis: 14 ppm/°C
- Z-axis CTE: 46 ppm/°C
- Glass Transition Temperature (Tg): >280 °C
- Moisture Absorption: 0.06%
- Non-Brominated

RO4003C Typical Value
Property	RO4003C	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.38±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.55	Z		8 to 40 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.0027 0.0021	Z		10 GHz/23℃ 2.5 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+40	Z	ppm/℃	-50℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	1.7 x 10¹⁰		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	4.2 x 10⁹		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2(780)	Z	Kv/mm(v/mil)	0.51mm(0.020")	IPC-TM-650 2.5.6.2
Tensile Modulus	19,650(2,850) 19,450(2,821)	X Y	MPa(ksi)	RT	ASTM D 638
Tensile Strength	139(20.2) 100(14.5)	X Y	MPa(ksi)	RT	ASTM D 638
Flexural Strength	276 (40)		MPa (kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.3	X,Y	mm/m (mil/inch)	after etch+E2/150℃	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	11 14 46	X Y Z	ppm/℃	-55℃to288℃	IPC-TM-650 2.4.41
Tg	>280		℃ TMA	A	IPC-TM-650 2.4.24.3
Td	425		℃ TGA		ASTM D 3850
Thermal Conductivity	0.71		W/M/oK	80℃	ASTM C518
Moisture Absorption	0.06		%	48hrs immersion 0.060" sample Temperature 50℃	ASTM D 570
Density	1.79		gm/cm³	23℃	ASTM D 792
Copper Peel Stength	1.05 (6.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	N/A				UL 94
Lead-free Process Compatible	Yes

S1000-2M Features

- Enhanced Z-axis CTE for improved through-hole reliability
- Excellent mechanical processability and thermal resistance
- Lead-free compatibility
- Tg: 180°C (DSC)
- UV blocking and AOI compatible
- High heat resistance with superior anti-CAF performance
- Low water absorption

PCB Specifications

- Layer Stackup:
- Copper Layer 1: 35 μm
- RO4003C Core: 0.305 mm (12 mil)
- Copper Layer 2: 35 μm
- Prepreg Bondply (1080 RC63%): 0.0644 mm (2.5 mil)
- Copper Layer 3: 35 μm
- FR-4 (Tg 170): 0.076 - 0.203 mm (3 mil)
- Copper Layer 4: 35 μm
- Prepreg Bondply (1080 RC63%): 0.0644 mm (2.5 mil)
- Copper Layer 5: 35 μm
- RO4003C Core: 0.305 mm (12 mil)
- Copper Layer 6: 35 μm

- Dimensions: 83.50 mm x 66 mm ± 0.15 mm
- Finished Board Thickness: 1.1 mm
- Finished Copper Weight: 1 oz (1.4 mils) on both inner and outer layers
-Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.2 mm
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Gold
- Solder Mask Color: Matt Green (top and bottom)
- Silkscreen Color: White (top only)
- Impedance Control: 50 ohm on 4 mil / 4 mil traces/gaps (top layer)
- Via Configuration: 0.2 mm via filled and capped
- Electrical Testing: 100% before shipment

Typical Applications

This PCB is ideal for a variety of advanced applications, including:

- Commercial airline broadband antennas
- Microstrip and stripline circuits
- Millimeter wave applications
- Radar systems
- Guidance systems
- Point-to-point digital radio antennas

Quality Assurance

Manufactured to IPC-Class 2 standards, our PCB ensures high reliability and performance. The artwork is supplied in Gerber RS-274-X format, compatible with most PCB design tools.

Global Availability

Our high-performance PCB is available for worldwide shipping, providing cutting-edge solutions wherever you are located.

Product Tags: RO4003C Hybrid PCB FR4 Material Hybrid PCB Impedance Controlled Hybrid PCB

Related Products

RO4003C Ultimate PCB High Frequency Material For RF Microwave Applications for sale


From:	Enter your Email please. Your email is incorrect!
To:	Bicheng Electronics Technology Co., Ltd
Subject:	Subject is empty!
Message:	Characters Remaining: (80/3000) Please enter 20 to 3000 characters to contact this supplier!

Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled

Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled

RO4003C Ultimate PCB High Frequency Material For RF Microwave Applications

TSM-DS3 PCB 0.6mm Thick Double-Sided Immersion Gold Finish

TLX-0 PCB 2-layer High-Frequency 20mil Laminate with HASL Finish

Taconic RF-60A PCB 2-layer 50mil Laminate with Pure Gold Plating

4-layer Hybrid PCB on RT duroid 5880 and FR4 material ENIG Finish

2-layer AD300D PCB 40mil Thick with EPIG Finish