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RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

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Ms.Ivy Deng
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RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit

Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99/PCS
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Material RT/duroid 6035HTC
Layer count 2-layer
PCB size 49.23mm x 55.55 mm=1PCS, +/- 0.15mm
PCB thickness 30mil
Copper weight 1oz (1.4 mils) outer layers
Surface finish Immersion Gold
Detailed Product Description

The RT/duroid 6035HTC PCB is engineered from high-frequency circuit materials designed specifically for high-power RF and microwave applications. Utilizing ceramic-filled PTFE composites, this PCB is an exceptional choice for demanding environments where thermal management and performance are critical. With a thermal conductivity nearly 2.4 times that of standard RT/duroid 6000 products, it ensures efficient heat dissipation, making it ideal for high-power applications.

 

Key features of the RT/duroid 6035HTC PCB include a dielectric constant (DK) of 3.5 ± 0.05 at 10 GHz and 23°C, along with an impressive dissipation factor of 0.0013 at the same frequency and temperature. The material exhibits a thermal coefficient of dielectric constant of -66 ppm/°C and a moisture absorption rate of just 0.06%. Additionally, with a thermal conductivity of 1.44 W/m/K at 80°C, this PCB provides excellent thermal performance, contributing to lower operating temperatures and enhanced reliability in high-power scenarios.

 

RT/duroid 6035HTC Typical Value
PropertyRT/duorid 6035HTCDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.50±0.05Z 10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.6Z 8 GHz - 40 GHzDifferential Phase Length Method
Dissipation Factor0.0013Z 10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-66Zppm/℃-50 ℃to 150℃mod IPC-TM-650, 2.5.5.5
Volume Resistivity108 MΩ.cmAIPC-TM-650, 2.5.17.1
Surface Resistivity108 AIPC-TM-650, 2.5.17.1
Dimensional Stability-0.11 -0.08CMD MDmm/m (mils/inch)0.030" 1oz EDC foil Thickness after etch '+E4/105IPC-TM-650 2.4.39A
Tensile Modulus329 244MD CMDkpsi40 hrs @23℃/50RHASTM D638
Moisure Absorption0.06 %D24/23IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃)19 19 39X Y Zppm/℃23℃ / 50% RHIPC-TM-650 2.4.41
Thermal Conductivity1.44 W/m/k80℃ASTM C518
Density2.2 gm/cm323℃ASTM D792
Copper Peel Stength7.9 pli20 sec. @288 ℃IPC-TM-650 2.4.8
FlammabilityV-0   UL 94
Lead-Free Process CompatibleYes    

 

PCB Material:Ceramic-filled PTFE composites
Designation:RT/duroid 6035HTC
Dielectric constant:3.50±0.05
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..

 

The construction of this PCB features a 2-layer rigid stackup, comprising 35 μm of copper on both layers and a 0.762 mm (30 mil) core of RT/duroid 6035HTC. Precise board dimensions of 49.23 mm x 55.55 mm (± 0.15 mm) are complemented by a finished board thickness of 0.83 mm and a minimum trace/space of 6/5 mils. With a minimum hole size of 0.6 mm and no blind vias, this PCB is crafted to meet stringent performance specifications. The immersion gold surface finish ensures excellent solderability, while the blue top solder mask enhances visibility during assembly.

This PCB is compatible with the Gerber RS-274-X artwork format and adheres to the IPC-Class-2 quality standard, ensuring it meets industry expectations. Additionally, it is available for worldwide, making it accessible to engineers globally.

 

Typical applications for the RT/duroid 6035HTC PCB include high-power RF and microwave amplifiers, couplers, filters, combiners, and power dividers. With its advanced thermal management capabilities and excellent high-frequency performance, this PCB is an invaluable asset for modern electronic designs demanding reliability and efficiency.

 

Product Tags: 30mil Immersion Gold Circuit PCB   RT duroid 6035HTC PCB   30mil Immersion Gold Circuit  
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