6.5mm RO4350B PCB Double Sided Circuits ENIG

Introducing our newly shipped PCB, featuring Rogers RO4350B material and RO4450F bondply. This advanced solution is designed for high-performance RF applications, combining the strengths of both materials to deliver exceptional reliability and efficiency. The RO4350B laminate offers electrical performance akin to PTFE/woven glass, while leveraging the manufacturability of epoxy/glass, making it a cost-effective choice for microwave applications.

Key Features of RO4350B
The RO4350B material boasts a dielectric constant of 3.48 ± 0.05 at 10 GHz and a low dissipation factor of 0.0037, ensuring minimal signal loss. With a thermal conductivity of 0.69 W/m·K and a high glass transition temperature (Tg) of over 280 °C, this material maintains stability across a wide range of operating conditions. The thermal expansion coefficient (CTE) is closely matched to copper, providing excellent dimensional stability, which is crucial for multi-layer board constructions.

Key Features of RO4450F
The RO4450F bondply enhances the PCB’s performance, offering a dielectric constant of 3.52 ± 0.05 at 10 GHz and a dissipation factor of 0.004. With a thermal conductivity of 0.65 W/m·K and a high Tg of over 280 °C, it is perfect for handling multiple lamination cycles. This bondply is also designed for compatibility with FR-4 materials, allowing for versatile multi-layer constructions.

PCB Stackup
The PCB features a robust 2-layer rigid stackup:
 

- Copper Layer 1: 35 μm
- RO4350B Core: 1.524 mm (60 mil)
- Prepreg Bond-ply (RO4450F): 0.101 mm (4 mil)
- RO4350B Core: 1.524 mm (60 mil)
- Prepreg Bond-ply (RO4450F): 0.101 mm (4 mil)
- RO4350B Core: 1.524 mm (60 mil)
- Prepreg Bond-ply (RO4450F): 0.101 mm (4 mil)
- RO4350B Core: 1.524 mm (60 mil)
- Copper Layer 2: 35 μm

Construction Details
This PCB measures 65 mm x 65 mm (± 0.15 mm) with a finished thickness of 6.5 mm. It supports a minimum trace/space of 7/8 mils and a minimum hole size of 0.5 mm. The finished copper weight is 1 oz (1.4 mils) on the outer layers, with a via plating thickness of 20 μm. The surface finish is ENIG, while the top silkscreen is yellow and the top solder mask is green. Each board undergoes 100% electrical testing before shipment to ensure quality.

Compliance and Availability
- Artwork Format: Gerber RS-274-X
- Quality Standard: IPC-Class-2
- Availability: Worldwide

Typical Applications
This PCB is ideal for:

- Cellular base station antennas and power amplifiers
- RF identification tags
- Automotive radar and sensors
- LNBs for direct broadcast satellites

Leverage the advanced properties of Rogers RO4350B and RO4450F in your next project to ensure high reliability and performance in demanding RF applications.