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RF-60TC PCB 10mil 2 Layer Immersion Tin Circuit Board

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng
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RF-60TC PCB 10mil 2 Layer Immersion Tin Circuit Board

Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99/PCS
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Material RF-60TC
PCB Thickness 10mil
PCB size 49.44 mm x 36.88 mm ± 0.15 mm
Copper weight 1OZ
Surface finish Immersion Tin
Detailed Product Description

We are excited to introduce our newly shipped 2-layer printed circuit board (PCB) featuring RF-60TC, a high-frequency laminate designed for high-power RF and microwave applications. This advanced material combines ceramic-filled, glass-reinforced PTFE with exceptional thermal conductivity, making it ideal for miniaturized antenna designs and other high-efficiency applications.

 

Key Features

RF-60TC boasts a dielectric constant (Dk) of 6.15 at 10 GHz and a low dissipation factor of 0.002, providing improved gains and efficiencies in RF circuits. Its high thermal conductivity—1.0 W/m*K for 0.5 oz copper and 1.05 W/m*K for 1 oz—ensures effective heat dissipation, reducing operating temperatures and enhancing the reliability of active components. Additionally, RF-60TC has a low moisture absorption rate of 0.03% and a thermal coefficient of Dk of -3.58 ppm/°C, ensuring stable performance across a wide temperature range.

 

PropertyTest MethodUnitValueUnitValue
Dk @ 10 GHzIPC-650 2.5.5.5.1 (Modified) 6.15 ± 0.15 6.15 ± 0.15
Df @ 10 GHzIPC-650 2.5.5.5.1 (Modified) 0.002 0.002
TcK ppm/°C-3.581ppm/°C-3.581
Dielectric BreakdownIPC-650 2.5.6kV55kV55
Dielectric StrengthIPC-650 2.5.6.2V/mil550V/mm21,654
Arc ResistanceIPC-650 2.5.1Seconds>180Seconds>180
Moisture AbsorptionIPC-650 2.6.2.1%0.03%0.03
Flexural Strength (MD)IPC-650 2.4.4psi10,000N/mm269
Flexural Strength (CD)IPC-650 2.4.4psi9,000N/mm262
Tensile Strength (MD)IPC-650 2.4.19psi9,000N/mm262
Tensile Strength (CD)IPC-650 2.4.19psi7,000N/mm248
Young’s Modulus (MD)ASTM D 3039/IPC-TM-650 2.4.19kpsi721N/mm24971
Poisson’s Ratio (MD)ASTM D 3039/IPC-TM-650 2.4.19 0.155 0.155
Peel Strength (1 oz. ED)IPC-650 2.4.8lbs/in8N/mm1.43
Thermal Conductivity (Unclad)IPC-650 2.4.50W/M*K0.9W/M*K0.9
Thermal Conductivity (CH/CH)IPC-650 2.4.50W/M*K1W/M*K1
Thermal Conductivity (C1/C1)IPC-650 2.4.50W/M*K1.05W/M*K1.05
Dimensional Stability (MD)IPC-650 2.4.39 Sec. 5.4 (After Bake)mils/in0.01mm/M0.01
Dimensional Stability (CD)IPC-650 2.4.39 Sec. 5.4 (After Bake)mils/in0.69mm/M0.69
Dimensional Stability (MD)IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)mils/in0.06mm/M0.06
Dimensional Stability (CD)IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)mils/in0.8mm/M0.8
Surface ResistivityIPC-650 2.5.17.1 (After Humidity)Mohm1.0 x 108Mohm1.0 x 108
Volume ResistivityIPC-650 2.5.17.1 (After Humidity)Mohm/cm1.0 x 108Mohm/cm1.0 x 108
CTE (X, Y axis)IPC-650 2.4.41 (RT- 150 °C)ppm/°C9.9ppm/°C9.9
CTE (Z axis)IPC-650 2.4.41 (RT- 150 °C)ppm/°C40ppm/°C40
Density (Specific Gravity)IPC-650 2.3.5g/cm32.84g/cm32.84
Specific HeatIPC-650 2.4.50J/gK0.94J/gK0.94
Td (2% Wt. Loss)IPC - 650 2.4.24.6 / TGA°F930°C500
Td (5% Wt. Loss)IPC - 650 2.4.24.6 / TGA°F960°C515
Flammability RatingUL 94 V-0 V-0

 

PCB Specifications

This PCB features a robust stackup consisting of:

 

- Copper Layer 1: 35 μm
- RF-60TC Core: 0.254 mm (10 mil)
- Copper Layer 2: 35 μm

 

The overall dimensions of the PCB are 49.44 mm x 36.88 mm ± 0.15 mm, with a finished thickness of 0.37 mm. It supports a minimum trace/space of 4/5 mils and a minimum hole size of 0.25 mm. The PCB is designed without blind vias, featuring a finished copper weight of 1 oz (1.4 mils) on both outer layers.

 

For surface finish, the PCB uses immersion tin, and it has a white silkscreen on the top side, while the bottom remains clear of silkscreen and solder mask. Each PCB undergoes 100% electrical testing prior to shipment to ensure optimal performance.

 

PCB Material:PTFE based, ceramic filled fiberglass
Designation:RF-60TC
Dielectric constant:6.15
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm)
PCB thickness:10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

Applications

This versatile PCB is suitable for a range of applications, including:

 

- High Power Amplifiers
- Miniaturized Antennas
- GPS, Patch, RFID Readers
- Filters, Couplers, and Dividers
- Satellite Components

 

Quality Assurance and Availability

This PCB is produced in accordance with IPC-Class 2 standards and is available for global shipping. The artwork is supplied in Gerber RS-274-X format, ensuring it is compatible with standard PCB design workflows.

 

Utilizing RF-60TC material allows you to attain superior performance and reliability in high-frequency applications, making it an ideal option for sophisticated RF circuit designs.

 

Product Tags: RF-60TC PCB   Immersion Tin PCB   10mil PCB  
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