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Taconic TLX-8 Laminate 2-Layer Rigid PCB 30mil High Frequency Substrate

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

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Ms.Ivy Deng
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Taconic TLX-8 Laminate 2-Layer Rigid PCB 30mil High Frequency Substrate

Solder mask No
PCB Thickness 0.85mm
PCB size 76.4mm × 98.6mm with ±0.15mm dimensional tolerance
Layer count Single Sided
Copper weight 1oz (1.4 mils) outer layers
Silkscreen White
Surface finish Pure Gold
Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99/PCS
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Material Taconic TLX-8
Detailed Product Description

The 2-layer Taconic TLX-8 rigid RF PCB is a high-reliability circuit board built with PTFE fiberglass laminate, specifically engineered for high-volume antenna systems and general microwave RF applications. Utilizing Taconic TLX-8 core substrate and standard 1oz outer copper layers, this 0.85mm thin high-frequency PCB adopts premium Pure Gold surface finishing and meets full IPC-Class-2 quality compliance. Each PCB undergoes 100% electrical testing prior to delivery, delivering ultra-low dielectric loss, tightly controlled dielectric constant, outstanding PIM performance, and exceptional resistance to harsh environments.

 

What Is Taconic TLX-8? Advanced Substrate Introduction

Taconic TLX-8 is a premium-grade PTFE fiberglass laminate widely adopted as a high-volume antenna substrate for a broad range of RF and microwave applications. Featuring flexible customizable thickness options and various copper cladding choices, this high-frequency material is highly optimized for low-layer-count microwave PCB layouts. It provides superior mechanical reinforcement and robust environmental endurance, making it an ideal substrate solution for electronic assemblies operating in extreme working conditions.

 

Taconic TLX-8 substrate delivers outstanding anti-creep performance under high-vibration operating conditions, reliable heat resistance for engine-mounted modules, radiation tolerance for space-grade devices, extreme seawater resistance for naval ship antennas, and consistent thermal stability for flight altimeter substrates. Thanks to its versatile environmental adaptability, Taconic TLX-8 PCBs maintain stable RF circuit performance across aerospace, marine, automotive, and industrial microwave systems.

 

 

Core Benefits of Taconic TLX-8 PCB

Taconic TLX-8 high-frequency PCB material combines superior electrical characteristics, stable mechanical properties, and reliable safety ratings, delivering comprehensive technical advantages:

 

Superior PIM Performance: Achieves passive intermodulation performance below -160 dBc, ensuring ultra-clean signal quality for sensitive antenna and communication systems

 

Consistent Electrical Properties: Features low, tightly controlled dielectric constant (Dk) and ultra-low dissipation factor (Df), minimizing high-frequency signal attenuation and maintaining stable transmission efficiency.

 

Enhanced Mechanical & Thermal Stability: Offers excellent dimensional stability and balanced thermal expansion behavior to prevent structural deformation during thermal cycling and mechanical stress

 

Minimal Moisture Absorption: Extremely low water absorption rate prevents electrical parameter deviation in high-humidity environments

 

High Flame Retardancy: Complies with UL 94 V0 safety standards, ensuring secure operation of high-frequency electronic equipment in industrial environments

 

Optimized Cost-Performance: Specially engineered for low-layer microwave PCB designs, balancing premium RF performance with cost-effective mass manufacturability

 

Properties of Taconic TLX-8

TLX-8 TYPICAL VALUES
PropertyTest MethodUnitValueUnitValue
DK @10 GHzIPC-650 2.5.5.3 2.55 2.55
Df @1.9 GHzIPC-650 2.5.5.5.1 0.0012 0.0012
Df @10 GHzIPC-650 2.5.5.5.1 0.0017 0.0017
Dielectric BreakdownIPC-650 2.5.6kV>45kV>45
Moisture AbsorptionIPC-650 2.6.2.1%0.02%0.02
Flexural Strength(MD)ASTM D 709psi28,900N/mm2 
Flexural Strength(CD)ASTM D 709psi20,600N/mm2 
Tensile Strength(MD)ASTM D 902psi35,600N/mm2 
Tensile Strength(CD)ASTM D 902psi27,500N/mm2 
Elongation at Break(MD)ASTM D 902%3.94%3.94
Elongation at Break(CD)ASTM D 902%3.92%3.92
Young's Modulus(MD)ASTM D 902kpsi980N/mm2 
Young's Modulus(CD)ASTM D 902kpsi1,200N/mm2 
Young's Modulus(MD)ASTM D 3039kpsi1,630N/mm2 
Poisson's RatioASTM D 3039 0.135N/mm 
Peel Stength(1 oz.ed)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch15N/mm 
Peel Stength(1 oz.RTF)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch17N/mm 
Peel Stength(½ oz.ed)IPC-650 2.4.8.3(Elevated Temp.)Ibs./linear inch14N/mm 
Peel Stength(½ oz.ed)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch11N/mm 
Peel Stength(1 oz.rolled)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch13N/mm2.1
Thermal ConductivityASTM F433/ASTM 1530-06W/M*K0.19W/M*K0.19
Dimensional Stability(MD)IPC-650 2.4.39 Sec.5.5(After Bake.)mils/in.0.06mm/M 
Dimensional Stability(CD)IPC-650 2.4.39 Sec.5.4(After Bake.)mils/in.0.08mm/M 
Dimensional Stability(MD)IPC-650 2.4.39 Sec.5.5(Thermal Stress.)mils/in.0.09mm/M 
Dimensional Stability(CD)IPC-650 2.4.39 Sec.5.5(Thermal Stress.)mils/in.0.1mm/M 
Surface ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)Mohm6.605 x 108Mohm6.605 x 108
Surface ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)Mohm3.550 x 106Mohm3.550 x 106
Volume ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)Mohm/cm1.110 x 1010Mohm/cm1.110 x 1010
Volume ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)Mohm/cm1.046 x 1010Mohm/cm1.046 x 1010
CTE(X axis)(25-260)IPC-650 2.4.41/ASTM D 3386ppm/21ppm/21
CTE(Y axis)(25-260)IPC-650 2.4.41/ASTM D 3386ppm/23ppm/23
CTE(Z axis)(25-260)IPC-650 2.4.41/ASTM D 3386ppm/215ppm/215
Density(Specific Gravity)ASTM D 792g/cm32.25g/cm32.25
Td(2% Weight Loss)IPC-650 2.4.24.6(TGA)535 
Td(5% Weight Loss)IPC-650 2.4.24.6(TGA)553 
Flammability RatingUL-94 V-0 V-0

 

Key PCB Construction Specifications

Parameter ItemSpecific Specification
Base MaterialTaconic TLX-8 PTFE fiberglass high-frequency laminate
Layer Count2 layers (double-sided rigid PCB structure)
Board Dimensions76.4mm × 98.6mm with ±0.15mm dimensional tolerance (1 piece)
Minimum Trace/Space5/7 mils minimum trace and space
Minimum Hole Size0.3mm minimum hole size
Via DesignThrough-hole-only structure with no blind vias
Finished Board Thickness0.85mm
Finished Copper Weight1oz (1.4 mils) outer copper weight
Via Plating Thickness20μm via plating thickness, providing durable via conductivity and long-term soldering reliability
Surface FinishPure Gold surface finish, delivering superior corrosion resistance, excellent solderability, and stable high-frequency performance
SilkscreenWhite top silkscreen with no bottom silkscreen for clear component labeling and easy assembly identification
Solder MaskNo top and bottom solder mask, maximizing heat dissipation and preserving original high-frequency electrical performance
Quality Test Standard100% electrical testing before shipment

 

 

2-Layer Taconic TLX-8 PCB Stack-up Structure

This 2-layer rigid PCB stack-up features genuine Taconic TLX-8 PTFE fiberglass core substrate paired with high-purity copper layers. This standardized low-loss stack-up provides tightly controlled dielectric parameters, excellent mechanical sturdiness, and outstanding environmental tolerance, perfectly matching low-layer-count microwave and high-frequency RF design requirements.

 

Layer SequenceMaterial SpecificationThicknessCore Function
Outer Layer 1 (Top)Conductive copper foil35μmPrimary signal transmission and SMT soldering layer for high-frequency RF circuits
Core Dielectric LayerTaconic TLX-8 PTFE fiberglass laminate0.762mm (30mil)Low-loss dielectric isolation layer with stable Dk/Df characteristics and extreme environmental resistance for microwave applications
Outer Layer 2 (Bottom)Conductive copper foil35μmSecondary conductive layer to balance structural stability and overall circuit performance

 

PCB Statistics

Parameter ItemSpecific Value
Components30
Total Pads41
Thru Hole Pads25
Top SMT Pads16
Bottom SMT Pads0
Vias27
Nets2

 

Accepted Artwork Format: We support standard Gerber RS-274-X files for custom PCB manufacturing, enabling precise fabrication and efficient technical collaboration with global customers.

 

Quality Standard: All PCBs are manufactured and inspected in accordance with IPC-Class-2 industrial standards, ensuring consistent batch quality and long-term operational reliability.

 

Global Service: We provide worldwide custom PCB quotation, professional technical consultation, and global shipping services for all customization projects.

 

Typical Application Scenarios

Radar Systems: High-stability substrate solutions for industrial detection and aerospace radar signal processing hardware

 

Mobile Communications: High-reliability circuit boards for cellular base stations and mobile signal transmission devices

 

Microwave Test Equipment: Precision PCB substrates for laboratory microwave testing, measurement, and calibration instruments

 

Microwave Transmission Devices: Low-loss circuit boards dedicated to microwave signal transmission and communication link systems

 

RF Passive & Active Components: Custom PCBs for RF couplers, splitters, combiners, power amplifiers, and high-frequency antenna assemblies

 

In conclusion, this 2-layer Taconic TLX-8 rigid PCB utilizes high-performance PTFE fiberglass substrate to deliver ultra-low Df loss, tightly controlled Df values, excellent PIM stability, and strong environmental adaptability. As a cost-effective and highly reliable solution for low-layer microwave designs, this high-frequency PCB is extensively applied in radar systems, mobile communication infrastructure, and precision microwave test equipment.

 

Product Tags: Adhesiveless Polyimide Flexible PCB   0.13mm Flexible PCB   Yellow Coverlay Flexible PCB  
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