6 Layer RO3003 Hybrid PCB With Blind Via And Immersion Gold

It's delighted to introduce our newly shipped PCB, designed with precision and reliability to meet your demanding electronic needs. This high-quality PCB is crafted using Rogers RO3003 ceramic-filled PTFE composites, ensuring exceptional performance and durability. With a dielectric constant of 3.0 +/- .04 at 10 GHz 23°C and a dissipation factor of 0.001 at 10 GHz 23°C, this PCB delivers reliable signal transmission and minimal loss.

The PCB's exceptional mechanical properties and low coefficient of thermal expansion (CTE) make it an ideal choice for various applications. Its low X, Y, and Z axis CTE of 17, 16, and 25 ppm/°C respectively enable reliable stripline and multi-layer board constructions. This makes it suitable for use in multi-layer board designs and hybrid designs with epoxy glass.

The 6-layer rigid PCB stackup ensures optimal performance and efficient signal routing. The copper layers, each measuring 18 μm, are interleaved with Rogers 3003 Core and Prepreg FastRise 28 layers, providing stability and signal integrity. The final PCB construction results in a finished board thickness of 1.22mm, with 0.5 oz (0.7 mils) inner layers and 1 oz (1.4 mils) outer layers of copper weight. The surface finish is achieved through immersion gold plating, ensuring excellent conductivity and corrosion resistance.

With a compact size of 82.91mm x 56.61mm and a tolerance of +/- 0.15mm, this PCB is designed for versatility and easy integration into your electronic systems. It supports a minimum trace/space of 5/5 mils and a minimum hole size of 0.3mm, allowing for intricate and precise circuit designs. The board features blind vias L1-L2 and L1-L3, enhancing connectivity and signal routing capabilities.

Complying with IPC-Class-2 quality standards, this PCB guarantees high-quality manufacturing and meticulous craftsmanship. It has undergone a 100% electrical test to ensure its integrity and reliability. The top layer of the PCB is designed to meet specific impedance requirements, featuring a 6mil track for 50-ohm single-end impedance and a 7mil/6mil track/gap for 100-ohm differential impedance.

With 70 components, 116 total pads, and 234 vias, this PCB offers ample space for your circuitry needs. It supports 28 nets and is compatible with Gerber RS-274-X artwork.

This PCB finds its applications in various fields, such as bandpass filters, microstrip patch antennas, voltage-controlled oscillators, and any application sensitive to temperature changes. Its -40℃ to +85℃ operating range ensures reliable performance in diverse environments.

Our PCB is available worldwide, and for any technical inquiries, please reach out to Ivy at sales10@bichengpcb.com. Trust our PCB to deliver exceptional performance, reliability, and ease of integration for your electronic projects.

Unveiling RO3003: The Paramount Material for High-Performance PCBs

Introduction:
In the realm of high-frequency electronic applications, the selection of the right PCB material is crucial for achieving optimal performance and reliability. Among the myriad of choices available, one material stands out as the paramount option: RO3003. With its exceptional characteristics and versatile properties, RO3003 has become the go-to material for engineers and designers seeking top-notch performance in their PCB designs. In this article, we will explore the reasons why RO3003 reigns supreme and why it should be your material of choice.

1. Unmatched Dielectric Performance:
RO3003 boasts a dielectric constant (ε) of 3.0 ± 0.04 at 10 GHz and 23°C, making it an ideal choice for high-frequency applications. Its excellent dielectric constant stability ensures consistent signal transmission and minimal loss, allowing for reliable and efficient circuit performance.

2. Low Dissipation Factor:
With a remarkably low dissipation factor (tanδ) of 0.001 at 10 GHz and 23°C, RO3003 minimizes energy loss and distortion in high-frequency circuits. This characteristic ensures that your signals remain pristine and accurate, enabling superior performance in applications up to 40 GHz.

3. Temperature Stability:
RO3003 exhibits exceptional dimensional stability, with a low thermal coefficient of ε and a coefficient of thermal expansion (CTE) of 17 ppm/°C (X-axis), 16 ppm/°C (Y-axis), and 25 ppm/°C (Z-axis). This stability guarantees reliable performance even under extreme temperature conditions, making it suitable for applications sensitive to temperature changes.

4. Mechanical Rigidity:
The mechanical properties of RO3003 make it an excellent choice for stripline and multi-layer board constructions. Its excellent dimensional stability ensures reliable and durable circuit designs, while its high tensile modulus provides robustness and protection against mechanical stress.

5. Versatile Design Possibilities:
RO3003's versatile nature allows for a wide range of design possibilities. It is particularly well-suited for multi-layer board designs, offering flexibility in creating complex circuitry configurations. Additionally, it seamlessly integrates with epoxy glass multi-layer board hybrid designs, further expanding its potential applications.

6. Exceptional Electrical Performance:
RO3003 meets stringent electrical performance requirements, with a top layer designed to achieve specific impedance requirements. With a 6mil track providing 50-ohm single-end impedance and a 7mil/6mil track/gap enabling 100-ohm differential impedance, RO3003 ensures precise signal integrity and reliable high-frequency performance.

7. Reliability and Quality Assurance:
Manufactured to IPC-Class-2 quality standards, RO3003 undergoes rigorous testing and quality control measures. It meets industry standards for copper peel strength, flammability (V-0), and lead-free process compatibility, ensuring a reliable and compliant solution for your PCB needs.

8. Wide Range of Applications:
RO3003 finds its application in a multitude of industries and projects. It is particularly well-suited for bandpass filters, microstrip patch antennas, voltage-controlled oscillators, and any application that requires superior performance, stability, and resistance to temperature variations.

9. Global Availability:
As a widely recognized and sought-after material, RO3003 is readily available worldwide. Whether you're located in North America, Europe, Asia, or any other region, you can access this paramount material to fulfill your PCB requirements.

Conclusion:
RO3003 stands tall as the paramount material for high-performance PCBs, offering unmatched dielectric performance, low dissipation factor, temperature stability, and versatile design possibilities. Its exceptional electrical performance, reliability, and global availability make it the preferred choice for engineers and designers across various industries. Embrace the power of RO3003 and unlock the full potential of your high-frequency electronic applications.