Rogers RT/duroid 5880LZ laminates are composite materials that are
filled with PTFE. They are specifically designed for use in
exacting strip-line and micro-strip circuit applications. These
laminates contain a unique filler that results in a low density of
1.4 gm/cm3, making them lightweight and ideal for high-performance,
weight-sensitive applications. The RT/duroid 5880LZ PCBs have a very low dielectric constant of
2.0 +/-0.04 and a low dissipation factor ranging from .0021 to
.0027 at 10GHz. The dielectric constant is uniform from panel to
panel and remains constant over a wide frequency range. The low
dissipation factor extends the usefulness of these PCBs to Ku-band
and above. Typical applications of RT/duroid 5880LZ laminates include airborne
antenna systems, lightweight feed networks, point-to-point digital
radio antennas, and other similar applications.
| Property | Typical Value RT/duroid® 5880LZ | Direction | Units | Condition | Test Method | | Dielectric Constant er,Process | 2.00 ± 0.04 | Z | | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | | Dielectric Constant er,Design | 2.00 | Z | | 8 GHz - 40 GHz | Differential Phase Length Method | | Dissipation Factor, tan | Typ: 0.0021 Max: 0.0027 | Z | | 10GHz/23°C | IPC-TM-650, 2.5.5.5 | | Thermal Coefficient of Dielectric Constant, er | +20 | Z | ppm/°C | -50°C to 150°C 10GHz | IPC-TM-650, 2.5.5.5 | | Volume Resistivity | 1.74 X 10^7 | | Mohm•cm | C-96/35/90 | IPC-TM-650, 2.5.17.1 | | Surface Resistivity | 2.08 X 10^6 | | Mohm | C-96/35/90 | IPC-TM-650, 2.5.17.1 | | Electrical Strength | 40 | | KV | D48/50 | IPC-TM-650, 2.5.6 | | Dimensional Stability | -0.38 | X,Y | % | | IPC-TM-650, 2.4.39A | | Moisture Absorption | 0.31 | | % | 24 hours/23°C | IPC-TM-650, 2.6.2.1 | | Thermal Conductivity | 0.33 | Z | W/m/°K | 80°C | ASTM C518 | | Coefficient of Thermal Expansion | 54, 47 40 | X,Y Z | ppm/°C | 0 to 150°C | IPC-TM-650, 2.4.41 | | Outgassing | | | | | | TML | 0.01 | | % | | ASTM E-595 | | CVCM | 0.01 | | | | WVR | 0.01 | | | | Density | 1.4 | | gm/cm^3 | | ASTM D792 | | Copper Peel | >4.0 | | pli | | IPC-TM-650, 2.4.8 | | Flammability | V-O | | | | UL 94 | | Lead-Free Process Compatible | YES | | | | |
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