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RT/Duroid 5870 Rogers PCB Board

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng
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RT/Duroid 5870 Rogers PCB Board

Brand Name Bicheng
Model Number BIC-090.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Base material RT/Duroid 5870
Layer count 1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed)
PCB thickness 10mil (0.254mm), 20mil (0.508mm), 31mil (0.787mm), 62mil (1.575mm)
PCB size ≤400mm X 500mm
Solder mask Green, Black, Blue, Yellow, Red etc.
Silkscreen White, Black, NO Silkscreen etc
Copper weight 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish Bare copper, HASL, ENIG, Immersion tin, OSP.
Detailed Product Description

 

Rogers High Frequency PCB Made on RT/duroid 5870 with 10mil, 20mil, 31mil and 62mil Coating with Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hello Everyone,

Today, we introduce high frequency PCB built on RT/duroid 5870 laminates.

 

RT/duroid 5870 is glass microfiber reinforced PTFE composite of Rogers Corporation, which is designed for exacting stripline and microstrip circuit applications.

 

 

Let's see the reasons for using RT/duroid 5870 material.

 

1) The randomly oriented microfibers result in exceptional dielectric constant uniformity.

 

2) The dielectric constant of RT/duroid 5870 laminates is uniform from panel to panel and is constant over a wide frequency range.

 

3) Its low dissipation factor extends the usefulness of RT/duroid 5870 laminates to Ku-band and above.

 

4) Designed for microstrip and stripline application

 

Our PCB Capability (RT/duroid 5870)

PCB Capability
PCB Material:Glass microfiber reinforced PTFE composites
Designator:RT/duroid 5870
Dielectric constant:2.33 ±0.02 (process)
2.33 (design)
Layer count:1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed)
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil (0.508mm)
31mil (0.787mm), 62mil (1.575mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion tin, OSP.
  

 

RT/duroid 5870 is often used in double sided PCB, multilayer PCB and hybrid PCB.It's available in a variety of thicknesses for double sided PCB, such as 10mil, 20mil, 31mil and 62mil. Surface finishes are bare copper, HASL, ENIG, Immersion tine and OSP for option.

 

 

The typical applications are

-microstrip and stripline circuits

-commercial airline broadband antenna

-radar systems

-millimeter wave applications

-point to point digital radio antenna etc.

 

The basic colour of RT/duroid 5870 PCB is black.

 

Appendix: Properties of RT/duroid 5870

RT/duroid 5870 Typical Value
PropertyRT/duroid 5870DirectionUnitsConditionTest Method
Dielectric Constant,εProcess2.33
2.33±0.02 spec.
ZN/AC24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign2.33ZN/A8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0005
0.0012
ZN/AC24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε-115Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
Volume Resistivity2 x 107ZMohm cmC/96/35/90ASTM D 257
Surface Resistivity3 x 107ZMohmC/96/35/90ASTM D 257
Specific Heat0.96(0.23)N/Aj/g/k
(cal/g/c)
N/ACalculated
Tensile ModulusTest at 23℃Test at 100℃N/AMPa(kpsi)AASTM D 638
1300(189)490(71)X
1280(185)430(63)Y
Ultimate Stress50(7.3)34(4.8)X
42(6.1)34(4.8)Y
Ultimate Strain9.88.7X%
9.88.6Y
Compressive Modulus1210(176)680(99)XMPa(kpsi)AASTM D 695
1360(198)860(125)Y
803(120)520(76)Z
Ultimate Stress30(4.4)23(3.4)X
37(5.3)25(3.7)Y
54(7.8)37(5.3)Z
Ultimate Strain44.3X%
3.33.3Y
8.78.5Z
Moisture Absorption0.02N/A%0.62"(1.6mm) D48/50ASTM D 570
Thermal Conductivity0.22ZW/m/k80℃ASTM C 518
Coefficient of Thermal Expansion22
28
173
X
Y
Z
ppm/℃0-100℃IPC-TM-650 2.4.41
Td500N/A℃ TGAN/AASTM D 3850
Density2.2N/Agm/cm3N/AASTM D 792
Copper Peel27.2(4.8)N/APli(N/mm)1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
FlammabilityV-0N/AN/AN/AUL 94
Lead-free Process CompatibleYesN/AN/AN/AN/A

 

 

We specialize in providing you with prototype, small batches and mass production service.

 

If you have any questions, please feel free to contact us.

 

Thank you for your reading.

 
Product Tags: RT Duroid 5870 Rogers PCB Board   20mil Rogers PCB Board  
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