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Dual Layer 30.7mil RO4350B Rogers PCB Board Lead Free

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng
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Dual Layer 30.7mil RO4350B Rogers PCB Board Lead Free

Brand Name Bicheng
Model Number BIC-136.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Base material Hydrocarbon Ceramic Laminates
Layer count Double Layer, Multilayer, Hybrid PCB
PCB thickness 10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm)
PCB size ≤400mm X 500mm
Solder mask Green, Black, Blue, Yellow, Red etc.
Copper weight 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish Bare copper, HASL, ENIG, OSP, Immersion tin etc..
Detailed Product Description

 

Dual Layer Rogers PCB Built on 30.7mil RO4350B LoPro Reverse Treated Foil With ENIG for Digital Applications

 

RO4350B LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4350B dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4350B laminate system.

 

Features and Benefits:

RO4350B materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

 

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

 

Lead-free process compatible

1. High temperature processing

2. Meets environmental concerns

 

CAF resistant

 

 

Our PCB Capability (RO4350B LoPro)

Our PCB Capability (RO4350B LoPro)
PCB Material:Hydrocarbon Ceramic Laminates
Designation:RO4350B LoPro
Dielectric constant:3.48±0.05
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin etc..

 

Some Typical Applications:

1. Digital applications such as servers, routers, and high speed back planes

2. Cellular base station antennas and power amplifiers

3. LNB’s for direct broadcast satellites

4. RF Identification Tags

 

Typical Properties of RO4350B LoPro

Typical Properties of RO4350B LoPro
PropertyTypical ValueDirectionUnitsConditionTest Method
Dielectric Constant, Process3.48 ± 0.05z--10 GHz/23°CIPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design3.55z--8 to 40 GHzDifferential Phase Length Method
Dissipation Factor tan,0.0037 0.0031z--10 GHz/23°C 2.5 GHz/23°CIPC-TM-650 2.5.5.5
Thermal Coeffifi cient of r50zppm/°C-50°C to 150°CIPC-TM-650 2.5.5.5
Volume Resistivity1.2 X 1010 MΩ•cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity5.7 X 109 COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)zKV/mm(V/mil)0.51mm(0.020”)IPC-TM-650 2.5.6.2
Tensile Modulus11473(1664)YMPa(kpsi)RTASTM D638
Tensile Strength175(25.4)YMPa(kpsi)RTASTM D638
Flexural Strength255(37) MPa(kpsi) IPC-TM-650 2.4.4
Dimensional Stability<0.5X,Ymm/m(mils/inch)after etch +E2/150°CIPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion14xppm/°C-55 to 288°CIPC-TM-650 2.1.41
16y
35z
Tg>280 °C TMAAIPC-TM-650 2.4.24.3
Td390 °C TGA ASTM D3850
Thermal Conductivity0.62 W/m/°K80°CASTM C518
Moisture Absorption0.06 %48 hrs immersion 0.060” sample Temperature 50°CASTM D570
Density1.86 gm/cm323°CASTM D792
Copper Peel Strength0.88(5.0) N/mm(pli)after solder float 1 oz. TC FoilIPC-TM-650 2.4.8
FlammabilityV-0   UL 94
Lead-Free Process CompatibleYes    

 

Product Tags: RO4350B Rogers PCB Board   30.7mil Rogers PCB Board   HASL Lead Free Rogers PCB Board  
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