China RF PCB Board manufacturer
Bicheng Electronics Technology Co., Ltd
We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
6
Home > Products > Rogers PCB Board >

Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards

Browse Categories

Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng
View Contact Details

Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards

Brand Name Bicheng
Model Number BIC-123.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Base material Ceramic-filled Laminates Reinforced with Woven Fiberglass
Layer count Double Layer, Multilayer, Hybrid PCB
PCB thickness 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size ≤400mm X 500mm
Solder mask Green, Black, Blue, Yellow, Red etc.
Copper weight 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish Bare copper, HASL, ENIG, OSP etc..
Detailed Product Description

 

Rogers RO3203 Double Sided 30mil High Frequency PCB With Green Mask For Wireless Telecommunications Systems

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO3203 High Frequency Circuit Materials of Rogers Corporation are ceramic-filled laminates reinforced with woven fiberglass. This material is engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz.

 

RO3203 laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using

standard PTFE circuit board processing techniques. Available cladding options are 0.5, 1 or 2 oz./ft2 (17, 35, 70 micron thick) electrodeposited copper foil. These laminates are manufactured under an ISO 9002 certified quality system.

 

Features:

1. Woven glass reinforcement improves rigidity for easier handling.

2. Low dielectric loss for high frequency performance can be used in applications exceeding 20 GHz.

3. Low in-plane expansion coefficient (matched to copper) is suitable for use with epoxy glass multilayer board hybrid designs and reliable surface mounted assemblies.

4. Surface smoothness allows for finer line etching tolerances

 

Typical Applications:

1. Base Station Infrastructure

2. Remote Meter Readers

3. Wireless Telecommunications Systems

 

PCB Capability (RO3203)

PCB Material:Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation:RO3203
Dielectric constant:3.02±0.04
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..

 

 

Data Sheet of RO3203

RO3203 Typical Value
PropertyRO3203DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.02±0.04Z 10 GHz/23℃IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ0.0016Z 10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Conductivity0.47 (3.2) W/mKFloat 100℃ASTM C518
Volume Resistivity107 MΩ.cmAASTM D257
Surface Resistivity107 AASTM D257
Dimensional Stability0.08X, Ymm/m +E2/150after etchIPC-TM-650 2.4.3.9
Tensile Modulus X YkpsiRTASTM D638
Flexural Modulus400 300X YkpsiAASTM D790
Tensile Strength12.5 13X YkpsiRTASTM D638
Flexural Strength9 8X YkpsiAASTM D790
Moisure Absorption<0.1 %D24/23IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion58 13Z X,Yppm/℃-50 ℃to 288℃ASTM D3386
Td500 TGAASTM D3850
Density2.1 gm/cm323℃ASTM D792
Copper Peel Stength10 (1.74) lbs/in (N/mm)After solderIPC-TM-650 2.4.8
FlammabilityV-0   UL 94
Lead-Free Process CompatibleYes    

 

Product Tags: 30mil Printed Circuit Boards   Wireless Telecommunications Rogers PCB Board   RO3203 Printed Circuit Boards  
Related Products
Email to this supplier
 
From:
Enter your Email please.
To: Bicheng Electronics Technology Co., Ltd
Subject:
Message:
Characters Remaining: (80/3000)