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TU-768 Lead Free PCB Multilayer Printed Circuit Board glass coated

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng View Contact Details

TU-768 Lead Free PCB Multilayer Printed Circuit Board glass coated

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Brand Name Bicheng
Model Number BIC-502.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Base material High-Tg and High Thermal Reliability Epoxy Resin
Layer count Double Layer, Multilayer, Hybrid PCB
PCB thickness 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB size ≤400mm X 500mm
Solder mask Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Copper weight 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
Surface finish Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Detailed Product Description

 

High Tg Lead Free Multi-layer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

 

 

Main Applications

Consumer Electronics

Server, workstation

Automotive

 

Key Features

Lead Free process compatible

Excellent coefficient of thermal expansion

Anti-CAF property

Superior chemical and thermal resistance

Fluorescence for AOI

Moisture resistance

 

Our PCB Capability (TU-768)

High Tg Lead Free Multi-layer Printed Circuit Board Built on TU-768 Core and TU-768P PrepregHigh-Tg and High Thermal Reliability Epoxy Resin
Designation:TU-768
Dielectric constant:4.3
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness:10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology:HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

 

Typical Properties of TU-768

 Typical ValuesConditioningIPC-4101 /126
Thermal   
Tg (DMA)190°C  
Tg (DSC)180°C > 170°C
Tg (TMA)170°CE-2/105 
Td (TGA)350°C > 340°C
CTE x-axis11~15 ppm/°C N/A
CTE y-axis11~15 ppm/°CE-2/105N/A
CTE z-axis2.70% < 3.0%
Thermal Stress,Solder Float, 288°C> 60 secA> 10 sec
T260> 60 min > 30 min
T288> 20 minE-2/105> 15 min
T300> 2 min > 2 min
Flammability94V-0E-24/12594V-0
DK & DF   
Permittivity (RC 50%) @10GHz4.3  
Loss Tangent (RC 50%) @10GHz0.018  
Electrical   
Permittivity (RC50%)   
1GHz (SPC method/4291B)4.4 / 4.3 < 5.2
5GHz (SPC method)4.3E-2/105N/A
10GHz (SPC method)4.3 N/A
Loss Tangent (RC50%)   
1GHz (SPC method/4291B)0.019 /0.018 < 0.035
5GHz (SPC method)0.021E-2/105N/A
10GHz (SPC method)0.023 N/A
Volume Resistivity> 1010 MΩ•cmC-96/35/90> 106 MΩ•cm
Surface Resistivity> 108 MΩC-96/35/90> 104 MΩ
Electric Strength> 40 KV/mmA> 30 KV/mm
Dielectric Breakdown> 50 kVA> 40 KV
Mechanical   
Young’s Modulus   
Warp Direction25 GPaAN/A
Fill Direction22 GPa  
Flexural Strength   
Lengthwise> 60,000 psiA> 60,000 psi
Crosswise> 50,000 psiA> 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil7~9 lb/inA> 4 lb/in
Water Absorption0.18%E-1/105+D-24/23< 0.8 %

 
Product Tags: Lead Free Multilayer Printed Circuit Board   E Glass Coated Printed Circuit Board   Hybrid PCB Printed Circuit Board  
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