2-layer TF300 PCB 25mil High Frequency Substrate with Immersion Gold

This is a customized 2-layer rigid high-frequency PCB fabricated with Wangling TF300 high-performance dielectric substrate, designed for high-stability microwave and millimeter-wave circuits and miniature antenna systems. The board is finished with immersion gold, with no solder mask or silkscreen applied on either top or bottom surfaces.

PCB Specification

PCB Layer Stack-up Structure

Artwork & Quality Standards

Artwork Format: Manufactured based on standard Gerber RS-274-X files, the industry-standard format ensuring high-precision patterning and full production compatibility.

Quality Standard: Manufactured and inspected in accordance with IPC-Class-2 reliability specifications, meeting general commercial and industrial-grade performance requirements.

Supply Coverage: Available for worldwide shipment with standardized production and complete quality control, supporting stable global delivery.

Wangling TF Series Material Overview

Wangling TF series substrates are high-performance high-frequency dielectric materials composed of PTFE resin and ceramic filler, featuring a fiberglass-free structure. The dielectric constant can be precisely tuned by adjusting the ceramic-to-PTFE ratio. Manufactured via proprietary processes, TF-series materials deliver outstanding microwave performance, superior thermal stability and long-term reliability, making them ideal for high-precision high-frequency PCB designs.

Core Material Performance Features

Tunable & Stable Dielectric Performance

TF300 features a stable, tunable DK of 3.0–16 with multiple standard options and ultra-low dielectric loss, perfectly meeting microwave and millimeter-wave circuit fabrication requirements.

Wide Temperature Stability

It enables continuous stable operation at -80℃ to +200℃, delivering outstanding thermal adaptability for harsh aerospace and industrial environments.

Customizable Thickness & High Processability

This material supports customized thickness ranging from 0.635mm to 2.5mm and is fully compatible with standard thermoplastic PCB manufacturing processes for high production yield.

Reliable Environmental Adaptability

With excellent radiation resistance and ultra-low outgassing properties, it maintains stable electrical and mechanical performance in extreme high-reliability working scenarios.

TF300 Typical Material Properties

Typical Application Scenarios

Aerospace equipment, space systems, aircraft and in-cabin electronic equipment

Microwave circuits, high-frequency antennas and phase-sensitive antenna devices

Early warning radars, airborne radars and radar signal processing modules

Phased array antennas and beamforming network systems

Satellite communication and navigation equipment

High-frequency power amplifier modules