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RO3003 Rogers PCB Board

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng
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RO3003 Rogers PCB Board

Brand Name Bicheng
Model Number BIC-095.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Base material RO3003
Layer count 1 Layer, 2 Layer, Multilayer, Hybrid PCB
PCB thickness 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size ≤400mm X 500mm
Solder mask Green, Black, Blue, Yellow, Red etc.
Copper weight 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish Bare copper, HASL, ENIG, OSP etc..
Detailed Product Description

 

Rogers RO3003 High Frequency PCB with 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold, Immersion Silver, Immersion Tin and HASL

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hello Everyone,

Today we’re going to talk about RO3003 high frequency PCBs.

 

RO3003 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designers to develop multi-layer board design feeling free and free, without encountering warpage or reliability problems.

 

Let’s look at some features and applications.

 

 

First of all, low dielectric loss, DF=0.001, it can be used in applications up to 77 GHz.

 

Secondly, Stable dielectric constant versus temperature and frequency, it’s ideal material for band pass filters, microstrip patch antennas, and voltage controlled oscillators.

 

Thirdly, excellent mechanical properties versus temperature, it’s reliable stripline and multi-layer board constructions.

 

Fourthly, Uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.

 

Finally, low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.

 

Our PCB Capability (RO3003)

PCB Capability
PCB Material:Ceramic-filled PTFE composite
Designator:RO3003
Dielectric constant:3.0 ±0.04 (process)
3.0 (design)
Layer count:1 Layer, 2 Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil (0.508mm)
30mil (0.762mm), 60mil (1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..
  

 

RO3003 high frequency PCBs are available with double sided, multi-layer and hybrid construction, copper ranges from 0.5oz to 2oz, thickness from 0.3mm to 1.6mm, maximum size 400 by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.

 

 

The typical Applications are automotive radar applications, power amplifiers and antennas, direct broadcast satellite etc.

 


 

The basic colour of RO3003 PCB is white.

 

The manufacturing process of RO3003 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.

 

Should you have any questions, please feel free to contact us.

 

Thank you for your reading.

 

Appendix: Data Sheet of RO3003

RO3003 Typical Value
PropertyRO3003DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.0±0.04Z 10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3Z 8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.001Z 10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-3Zppm/℃10 GHz -50℃to 150℃IPC-TM-650 2.5.5.5
Dimensional Stability0.06
0.07
X
Y
mm/mCOND AIPC-TM-650 2.2.4
Volume Resistivity107 MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity107 COND AIPC 2.5.17.1
Tensile Modulus930
823
X
Y
MPa23℃ASTM D 638
Moisture Absorption0.04 %D48/50IPC-TM-650 2.6.2.1
Specific Heat0.9 j/g/k Calculated
Thermal Conductivity0.5 W/M/K50℃ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
16
25
X
Y
Z
ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
Td500 ℃ TGA ASTM D 3850
Density2.1 gm/cm323℃ASTM D 792
Copper Peel Stength12.7 Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0   UL 94
Lead-free Process CompatibleYes    

 

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