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Rogers PCB 60mil 1.524mm RO4003C Double Sided RF PCB for WLAN

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng
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Rogers PCB 60mil 1.524mm RO4003C Double Sided RF PCB for WLAN

Brand Name Bicheng
Model Number BIC-005.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Base material Rogers 4300C
PCB Size 84 x 78mm=1PCS
Copper weight 1oz
Surface finish Electroless nickel over Immersion Gold
Layer count 2 Layer
PCBthickness 1.6mm
Detailed Product Description

 

Rogers 4003 60mil 1.524mm Circuit Board RO4003C High Frequency PCB Double Sided RF PCB for WLAN

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Hydrocarbon ceramic laminates made of RO4003C are intended to provide excellent high frequency performance and inexpensive circuit construction. Once working frequencies reach 500 MHz and beyond, designers have a much smaller number of laminates to choose from. Designers of RF microwave circuits, matching networks, and controlled impedance transmission lines can rely on the features of RO4003C material. Higher operating frequencies prevent the use of standard circuit board materials in many applications, while low dielectric loss enables RO4003C material to be employed in those applications.

 

The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range. RO4003C material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4003C is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4003C provides reliable plated through-hole quality, even in severe thermal shock applications. RO4003C material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.

 

PCB Specifications

PCB SIZE84 x 78mm=1PCS
BOARD TYPERF PCB, Microwave PCB
Number of LayersDouble sided PCB
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ------- 35um(1oz)+PLATE
RO4003C 60mil
copper ------- 35um(1oz)+PLATE
TECHNOLOGY 
Minimum Trace and Space:10mil/12mil
Minimum / Maximum Holes:0.3/2.3mm
Number of Different Holes:4
Number of Drill Holes:155
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance ControlNO
BOARD MATERIAL 
Glass Epoxy:RO4003C 60mil, Tg 288
Final foil external:1.5oz
Final foil internal:0oz
Final height of PCB:1.6mm ±0.16
PLATING AND COATING 
Surface FinishElectroless nickel over Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel)
Solder Mask Apply To:no Solder mask reqruied
Solder Mask Color:no solder mask required
Solder Mask Type:no solder mask reqruied
CONTOUR/CUTTINGRouting
MARKING 
Side of Component Legendno silkscreen required
Colour of Component Legendno silkscreen required
Manufacturer Name or Logo:no silkscreen required
VIAPlated Through Hole(PTH)
FLAMIBILITY RATINGN/A
DIMENSION TOLERANCE 
Outline dimension:0.0059" (0.15mm)
Board plating:0.0030" (0.076mm)
Drill tolerance:0.002" (0.05mm)
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

 

 

Typical applications are automotive radar and sensors, cellular base station antennas, direct broadcast satellites and low noise block etc.

 

Data Sheet of Rogers 4003C (RO4003C)

RO4003C Typical Value
PropertyRO4003CDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.38±0.05Z 10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.55Z 8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0027
0.0021
Z 10 GHz/23
2.5 GHz/23
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+40Zppm/-50to 150IPC-TM-650 2.5.5.5
Volume Resistivity1.7 x 1010 MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity4.2 x 109 COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength139(20.2)
100(14.5)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength276
(40)
 MPa
(kpsi)
 IPC-TM-650 2.4.4
Dimensional Stability<0.3X,Ymm/m
(mil/inch)
after etch+E2/150IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion11
14
46
X
Y
Z
ppm/-55to288IPC-TM-650 2.4.41
Tg>280  TMAAIPC-TM-650 2.4.24.3
Td425  TGA ASTM D 3850
Thermal Conductivity0.71 W/M/oK80ASTM C518
Moisture Absorption0.06 %48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density1.79 gm/cm323ASTM D 792
Copper Peel Stength1.05
(6.0)
 N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
FlammabilityN/A   UL 94
Lead-free Process CompatibleYes    

 

 

Product Tags: 60mil Ceramic PCB Board   1.524mm Ceramic PCB Board  
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