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High frequency PCB Rogers 10mil 0.254mm RO4350B Double Sided RF PCB

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng
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High frequency PCB Rogers 10mil 0.254mm RO4350B Double Sided RF PCB

Brand Name Bicheng
Model Number BIC-004.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Base material Rogers 4350B
PCB Size 30x80=1 up
Copper weight 1oz
PCB thickness 0.3mm
Surface finish immersion gold
Layer count 2 layers
Detailed Product Description

 

High Frequency PCB Rogers 10mil 0.254mm RO4350B Double Sided RF PCB for LTE

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO4350B hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above. RO4350B material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4350B material to be used in many applications where higher operating frequencies limit the use of conventional circuit board materials.

 

The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range. RO4350B material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4350B is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4350B provides reliable plated through-hole quality, even in severe thermal shock applications. RO4350B material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.

 

Parameters of a type of 0.3mm RO4350B PCB

PCB SIZE30 x 80mm=1up
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsYES
Through Hole ComponentsNO
LAYER STACKUPcopper ------- 35um(1 oz)+plate TOP layer
RO4350B 0.254mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY 
Minimum Trace and Space:N/A
Minimum / Maximum Holes:N/A
Number of Different Holes:N/A
Number of Drill Holes:0
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL 
Glass Epoxy:RO4350B Tg280℃, er<3.48, Rogers Corp.
Final foil external:1.5 oz
Final foil internal:N/A
Final height of PCB:0.3 mm ±0.1
PLATING AND COATING 
Surface FinishImmersion gold, 16%
Solder Mask Apply To:N/A
Solder Mask Color:N/A
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING 
Side of Component LegendN/A
Colour of Component LegendN/A
Manufacturer Name or Logo:N/A
VIANO
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

 

Typical applications are as follows:

Automotive Radar and Sensors

Cellular Base Station Antennas

Direct Broadcast Satellites

Low Noise Block

Power amplifiers

RFID

 

 

RO4350B Typical Value
PropertyRO4350BDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.48±0.05Z 10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.66Z 8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0037
0.0031
Z 10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+50Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
Volume Resistivity1.2 x 1010 MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity5.7 x109 COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength203(29.5)
130(18.9)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength255
(37)
 MPa
(kpsi)
 IPC-TM-650 2.4.4
Dimensional Stability<0.5X,Ymm/m
(mil/inch)
after etch+E2/150℃IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion10
12
32
X
Y
Z
ppm/℃-55℃to288℃IPC-TM-650 2.4.41
Tg>280 ℃ TMAAIPC-TM-650 2.4.24.3
Td390 ℃ TGA ASTM D 3850
Thermal Conductivity0.69 W/M/oK80℃ASTM C518
Moisture Absorption0.06 %48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density1.86 gm/cm323℃ASTM D 792
Copper Peel Stength0.88
(5.0)
 N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability(3)V-0   UL 94
Lead-free Process CompatibleYes    

 

Product Tags: 0.254mm PCB   RO4350B PCB   High frequency PCB  
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