491 - 500 of 743
motherboard multi layer pcb
Selling leads
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10 Layer FR4 PCB HDI Board For Control System 1. 10 layer board. 2. FR4 Tg170 material. 3. blind via resin hole + plating filled,Buried via,Pads over ...
2024-12-09 13:17:07
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High Density Interconnect PCB Board Manufacturing 1. 12 layer hdi board with ENIG 3u''. 2. FR4 Tg170 clad. 3. Communication application. 4. Blind...
2024-12-09 13:27:07
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... Min Hole Size 0.1mm Min Line Width/Space 3mil(0.075mm) Board Outline Tolerance 士0.10mm Insulation Layer Thickness 0.075mm--5.00mm Out Layer Copper ...
2024-12-09 13:35:10
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Prototype Circuit Board PCB Board UL ISO High Frequency 4 Layer Circuit Board Capacity: Item Capacity Raw material Aluminum base, Cooper base Layer 1...
2024-12-09 13:36:27
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Prototype PCB Assembly OEM 2 4 6 8 Layers SMT Electronic Circuit Board Capacity: Item Capacity Raw material Aluminum base, Cooper base Layer 1-8 Layer ...
2024-12-09 13:36:27
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... Maximum Size 600mmX1200mm Board Outline Tolerance +0.10mm Thickness Tolerance(t≥0.8mm) ±8% Thickness Tolerance(t
2024-12-09 13:36:36
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...PCB circuit boards for wireless charger medical electronics Capacity: Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High ...
2024-12-09 13:38:46
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...PCB Board with Blind Buried Holes Technical & Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE...
2024-12-09 13:43:39
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... Min Hole Size 0.1mm Min Line Width/Space 3mil(0.075mm) Board Outline Tolerance 士0.10mm Insulation Layer Thickness 0.075mm--5.00mm Out Layer Copper ...
2024-12-09 18:56:54
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High Density Interconnect PCB Board Manufacturing 1. 12 layer hdi board with ENIG 3u''. 2. FR4 Tg170 clad. 3. Communication application. 4. Blind...
2024-12-09 18:57:10
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