Led Light Main PCBA Customized 3D Printing High Density Interconnect Circuit

Led Light Main PCBA Customized 3D Printing High Density Interconnect Circuit

Design Procedure of Main PCBA

Manufacturing starts from the fabrication data generated by computer aided design, and component information. The fabrication data is read into the CAM (Computer Aided Manufacturing) software. CAM performs the following functions:

1. Input of the fabrication data.
2. Verification of the data
3. Compensation for deviations in the manufacturing processes (e.g. scaling to compensate for distortions during lamination)
4. Panelization
5. Output of the digital tools (copper patterns, drill files, inspection, and others)

Solder resist application in Main PCBA

Areas that should not be soldered may be covered with solder resist (solder mask). The solder mask is what gives main PCBA their characteristic green color, although it is also available in several other colors, such as red, blue, purple, yellow, black and white. One of the most common solder resists used today is called "LPI" (liquid photoimageable solder mask).A photo-sensitive coating is applied to the surface of the PWB, then exposed to light through the solder mask image film, and finally developed where the unexposed areas are washed away. Dry film solder mask is similar to the dry film used to image the PWB for plating or etching. After being laminated to the PWB surface it is imaged and developed as LPI. Once but no longer commonly used, because of its low accuracy and resolution, is to screen print epoxy ink. In addition to repelling solder, solder resist also provides protection from the environment to the copper that would otherwise be exposed.

Specification

Advantages of CESGATE:

1. Professional component certification engineer
2. Perfect IQC inspection system
3. Assist in improving customer BOM accuracy

4. Solve the problem of R&D samples
5. Professional supply chain team support
6. R&D procurement can also enjoy VIP customer service

FAQ