The Semiconductor Packaging film is a release film that uses
ultra-high-quality fluoride as the base material for tape casting.
It has the characteristics of low surface energy, high melting
point, high strength, and high elongation.
It is suitable for the release of plastic packaging in the
semiconductor and LED industries, and solves the problems of knife
marks, pitting, and frame overflow on the surface of plastic
packaging products.
Semiconductor Packaging film parameter| Model | Bacjing | Total thickne(um) | Surface roughness(um) | Tensile Strength (Mpa) | Elongation at break(%) | Continuous temperature resistance | flame retardant |
| | 25/50/60/75 | ＜0.04 | 48 | 300 | | V0 |
Semiconductor Packaging film Features
· Excellent release ability for different material surfaces;
· High tensile strength and high elongation at high temperature,
supporting the precise conformation of complex molds with large
height differences;
The melting point is 260°C, and it can work at 160°C for a long
time;
· Glossy and matte surfaces are optional to support different final
product surface requirements;
· Solve the overflow problem during the plastic sealing process.
