Ceramic Substrate Laser Imaging Equipment ±10μm Outer Alignment Accuracy

Laser Imaging Equipment for Ceramic Substrate ±10μm Outer Alignment Accuracy ODB++ File Format

Product Description:

Laser Direct Imaging (LDI) is a groundbreaking laser printing technology that has revolutionized the manufacturing process. With LDI, manufacturers can quickly and accurately produce high-quality printed circuit boards, ceramic substrates and other complex components. The Laser Direct Imaging Machine is a state-of-the-art LDI direct printing equipment that offers excellent outer alignment accuracy of ±10μm, a technology raster of 25/25μm line width/line spacing, and a 20μm inner alignment accuracy. It is also compatible with a variety of file formats including Gerber274x and ODB++.
The Laser Direct Imaging Machine is designed for many different applications, from inner and outer imaging to ceramic substrate printing. Its laser printing technology ensures that all components are produced with the highest precision and accuracy, making it the ideal choice for manufacturers looking for reliable and cost-effective printing solutions.
With its advanced laser printing technology, the Laser Direct Imaging Machine offers unmatched speed and precision. Its outer alignment accuracy of ±10μm, technology raster of 25/25μm line width/line spacing, and inner alignment accuracy of 20μm provide manufacturers with unparalleled accuracy and reliability. Additionally, its compatibility with a variety of file formats, including Gerber274x and ODB++, makes it easy to use and integrate into a variety of production processes.
The Laser Direct Imaging Machine is an ideal choice for any manufacturer looking for reliable, cost-effective and accurate printing solutions. With its advanced laser printing technology, precision and accuracy, it is the perfect tool for any production environment.

Features:

• Product Name: Laser Direct Imaging Machine
• Applicable process: Inner, Outer, Ceramic Substrate
• Text information: Support The Board To Set Text And Serial Number And Other Traceable Information
• Effective exposure area: 610mm*710mm
• Outer alignment accuracy: ±10μm
• Line width tolerance: ±10%
• Keywords: Laser_Imaging_Equipment, Laser_Imaging_Equipment, Laser_Direct_Printing

Technical Parameters:

Applications:

The GIS Laser DPX230 Laser Direct Imaging (LDI) System is a high-performance laser printing equipment for traceable information printing, based on laser direct printing technology. It is suitable for inner, outer and ceramic substrates. With an effective exposure area of 610mm*710mm, it can accurately print text, serial numbers and other traceable information. The line width/line spacing of this machine is 25/25μm, and the line width tolerance can reach ±10%. This system is reliable and efficient, and can meet the requirements of most industrial production and printing.
The GIS Laser DPX230 LDI System is widely used in a variety of industrial production and printing processes. For example, in the PCB industry, it is used to print text and serial numbers on the board, which can improve the production efficiency and product traceability. In the electronics industry, this system is used to print circuit patterns on ceramic substrates, which can ensure product consistency and accuracy. In the semiconductor industry, it is used to print traceable information on the substrate, which can greatly improve the production efficiency and product performance.
The GIS Laser DPX230 LDI System is the perfect choice for industrial production and printing. It can provide users with reliable and efficient printing services, greatly improving production efficiency and product accuracy. It is the ideal choice for industrial production and printing.

Customization:

GIS Laser DPX230 - Laser Direct Imaging Machine
This laser direct imaging machine (LDI print system) from GIS Laser features an effective exposure area of 610mm*710mm and is ideal for LDI direct printing. It offers excellent line width tolerance of ±10%, and an inner alignment accuracy of 20μm and outer alignment accuracy of ±10μm. Additionally, this machine supports the board to set text and serial numbers and other traceable information.

Support and Services:

We provide technical support and services for our Laser Direct Imaging Machine to ensure our customers receive the best performance and most reliable operation. We offer:

• Phone and online technical support
• Onsite maintenance and repair
• Software and firmware updates
• Replacement parts and accessories
• Training and certification programs

Our team of experienced technicians is dedicated to providing the highest level of service and support. We are available to answer any questions and address any issues quickly and efficiently.

Packing and Shipping:

The packaging and shipping of the Laser Direct Imaging Machine should follow these guidelines:

• The unit should be packaged in a double-box structure, with the inner box being made of shock-absorbent material.
• Fill the box with enough packing material to ensure that the unit will not be damaged during shipping.
• Place the package in a larger box for added protection.
• Label the package with "Fragile" and "This Side Up" for easy identification.
• Ship the package via a reliable delivery service.

FAQ:

Q1: What is GIS Laser DPX230 Laser Direct Imaging Machine?
A1: GIS Laser DPX230 Laser Direct Imaging Machine is a machine designed for high-precision direct imaging of printed circuit boards. It features a high-speed laser beam and advanced imaging technology for superior performance and accuracy.
Q2: What are the advantages of GIS Laser DPX230 Laser Direct Imaging Machine?
A2: GIS Laser DPX230 Laser Direct Imaging Machine offers high-precision imaging with high-speed laser beam and advanced imaging technology, as well as low maintenance costs, excellent repeatability, and ease of use.
Q3: Where is GIS Laser DPX230 Laser Direct Imaging Machine made?
A3: GIS Laser DPX230 Laser Direct Imaging Machine is made in Suzhou, China.
Q4: What type of materials can GIS Laser DPX230 Laser Direct Imaging Machine be used on?
A4: GIS Laser DPX230 Laser Direct Imaging Machine is suitable for imaging on various printed circuit board materials, including FR4, FR5, CEM-1, CEM-3, and polyimide.
Q5: How long is the warranty of GIS Laser DPX230 Laser Direct Imaging Machine?
A5: GIS Laser DPX230 Laser Direct Imaging Machine comes with a one-year warranty from the date of purchase.