CTS700 133LPI Laser Direct Imaging Machine 2540dpi

3D Glass Cover Panel LDI Laser Direct Image Exposure Machine For Vehicle Glass

Automatic Exposure Machine

The production of PCB originally used printing to draw the circuit diagram on the PCB. Now it is mainly made by scattering light source exposure machine or parallel light source exposure machine. In the traditional manual exposure machine, the whole process is completed manually, and the alignment accuracy is judged by human eyes. The batch alignment accuracy is generally maintained at ± 50 μm. At present, PCB has developed towards the direction of high precision, small aperture and multi-layer. The requirement for position accuracy is up to ± 10 μm, which has exceeded the limit of human eye resolution. Therefore, the requirements for PCB manufacturing and testing equipment will be more and more stringent. The semi-automatic and full-automatic exposure machine adopts the CCD visual automatic alignment technology, which has the advantages of fast alignment speed, high alignment accuracy and good product

GIS DLP Exposure machine for 3D glass patterning, providing high-resolution, high-throughput and high-yield to customers by DLP technology and powerful software. Equipped with stable cooling system, ensured that the interior of equipment is maintained at constant temperature of 22°C to guarantee the stability. Applied the semiconductor photolitho process with “negative photoresist” to BM patterning process, customers are able to transfer high quality patterns to 3D cover glass. This manufacturing technology significantly improve the one-pass yield to over 95% with fine patterns and better rendering.

Advanced Automation Line for 3D Cover Glass

This automation line is used to produce BM patterning process on 3D glass for smart phone;

3D raw glass material input by fully equipped automatic loading machine, followed by plasma cleaner, automatic spraying machine, tunnel oven, DLP exposure machine, developing and washing machine, final goods output by unloading machine;

Up to 30um resolution, over 95% of yield, thinning BM layer that easier for assembly, higher pattern quality and lower cost of ownership for customers;

                                                                                            *Specifications subject to change without notice

About US

GIS Intelligent Inc., subsidiary corporation of GIS Tech Inc., focusing on advanced solution for Lithium battery fabrication and 3D cover glass patterning. GIS Tech Inc. was established by founders from U.S in 2015, Suzhou China, developing Digital Lighting Processing (DLP) specially for different industry patterning solution needs, which enable MEMS/Glass /PCB/Screen printing manufacturers to achieve the best imaging results with the highest throughput.

We are the leader in automation solution for 3D cover glass in the world, which was used to produce high quality BM patterning on large curvature glass by DLP photolitho. Our DLP systems powered by Dr. Takeda, together with GIS’s semiconductor laser diodes technologies to achieve enhanced Depth-of-Focus for 3D topography changes, as well as patterning uniformity.

The core team of GIS Tech come from the top 500 international companies from the United States. Based on over 20 years experience of semiconductor technology, automation and materials teams, we fully understand and master the industry‘s development trend and cutting-edge technology. Our expertise in transferring patterns on cover glass materials at high curvature level and irregular shaped enables customers to transform possibilities into reality, especially for 3C smart electronics and automobile cover glass.