PCB HDI FPC Laser Direct Imaging Equipment 610x710mm
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laser direct imaging (LDI) system solutions HDI PCB
LDI is used for imaging requirements for HDI PCB mass production In order to meet the requirements of HDI PCB mass production, the imaging method shall: While achieving a low defect rate and high output, it can achieve the stable production of HDI PCB conventional high-precision operation. For example: * Advanced mobile phone board, CSP pitch less than 0.5mm (with or without wires between BGA pads) * The plate structure is 3 + N + 3, and there are stacked via hole.
In terms of imaging, such designs require a ring width of less than 75μm. In some cases, the ring width is even less than 50μm. Due to the alignment problem, these inevitably lead to low output. In addition, driven by miniaturization, the lines and spacing are becoming thinner and thinner - meeting this challenge requires changing the traditional imaging methods. This can be done by reducing the panel size or use a shutter exposure machine for panel imaging in several steps (four or six). Both methods achieve better alignment by reducing the influence of material deformation. Changing the panel size leads to high material costs, and using the shutter exposure machine leads to low production every day. Neither method can completely solve the material deformation and reduce the defects related to the photographic film, including the actual deformation of the photographic film when printing batch boards.
PCB laser direct imaging (LDI)
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Product Tags: FPC laser direct imaging equipment FPC PCB laser direct imaging equipment FPC HDI laser direct imaging pcb |
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Laser Direct Imaging HDI PCB 380 Volt Three Phase |
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PCB HDI FPC Laser Direct Imaging Equipment 610x710mm |
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LD Laser HDI PCB 380 Volt Three Phase 610x710mm |
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