China PCB Printed Circuit Board manufacturer
Quanhong FASTPCB
Professional medium and high-end samples, small and medium batch OEM PCB / PCBA manufacturers
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High Density Pcb Multi Layer Printed Circuit Board 2.0mm

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Quanhong FASTPCB

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86--18820288062

Contact Person:
Mr.Yu
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High Density Pcb Multi Layer Printed Circuit Board 2.0mm

Brand Name FASTPCB
Place of Origin CHINA
Minimum Order Quantity 10PCS
Price USD 0.01-100PCS
Supply Ability 10PCS+48Hour(production time )
Packaging Details Corrugated case
PCB High Density Multilayer Printed Circuit Board
Base Material FR-4 TG170
Number Of Layers 20 Layer
Board Thickness 2.0mm
Min. Hole Size 0.25mm
Min. Line Width 0.075mm
Min. Line Spacing 0.075mm
Solder Mask Color Green
Surface Treatment Immersion Gold
characteristic 1 Backdrill
characteristic 2 Hole on pad
Detailed Product Description

High Density Multilayer Printed Circuit Board

High Density Multilayer Printed Circuit Board is a special process printed circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd., which is made of FR-4 material and surface gold deposition. The minimum line width and line spacing can reach 75 / 75um and the minimum aperture can reach 0.2mm. The circuit board is widely used in mobile phones, laptops, automobiles, tablet computers and other fields.
 

HDI Advanced Technology

ItemHDI Advanced Technology
201920202021
Structure5+n+56+n+67+n+7
HDI Stack ViaAnyLayer(12L)AnyLayer(14L)AnyLayer(16L)
Board Thickness(mm)Min. 8L0.450.40.35
Min. 10L0.550.450.4
Min. 12L0.650.60.55
MAX. 2.4 
Min. Core Thickness ( um )504040
Min. PP Thickness ( um )30(#1027PP)25(#1017PP)20(#1010PP)
Base Copper ThicknessInner Layer ( OZ)1/3 ~ 21/3 ~ 21/3 ~ 2
Outer Layer ( OZ )1/3 ~ 11/3 ~ 11/3 ~ 1
ItemHDI Advanced Technology
201920202021
Min. Mechanical Drill hole size(um) **200200150
Max. Through Hole Aspect Ratio *8:110:110:1
Min. Laser via/Pad Size ( um )75/20070/17060/150
Max. Laser Via Aspect Ratio0.8:10.8:10.8:1
Laser Via on PTH(VOP)designYesYesYes
Laser X type through hole(DT≤200um)NA60~100um60~100um
Min. LW/S (L/S/Cu, um)Inner Layer45 /45 /1540/ 40/ 1530/ 30 /15
outer Layer50 /50/ 2040 /50 /2040 /40 /17
Min BGA Pitch (mm) 0.350.30.3
ItemHDI Advanced Technology
201920202021
Solder mask Registration (um)+/- 30+/- 25+/- 20
Min. Solder Mask Dam (mm)0.070.060.05
PCB Warpage Control>= 50ohm+/-10%+/-8%+/- 5%
< 50ohm+/- 5ohm+/- 3ohm+/- 3ohm
PCB Warpage Control≤0.5%≤0.5%≤0.5%
cavity Depth accuracy (um)Mechanical+/- 75+/- 75+/- 50
Laser directly+/- 50+/- 50+/- 50
Surface FinishingOSP,ENIG,Immersion Tin,Hard Au, Immersion AgOSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG

 

HLC Advanced Technology

ItemHLC Advanced Technology
201920202021
Max Panel Width (inch)252525
Max Panel Length (inch)292929
Max Layer Count (L)161836
Max Board thickness (mm)3.246
Max Board thickness Tolerance+/-10%+/-10%+/-10%
Base copper ThicknessInner layer ( OZ )468
Outer Layer ( OZ )234
Min DHS ( mm )0.20.150.15
PTH Size Tolerance ( mil )+/-2+/-2+/-2
Back Drill (stub)( mil )~ 3~ 2.4~ 2
Max. AR12:116:120:1
ItemHLC Advanced Technology
201920202021
M-drill toleranceInner layer ( mil )DHS + 10DHS + 10DHS + 8
Outer Layer ( mil )DHS + 8DHS + 8DHS + 6
Solder mask Registration (um)+/- 40+/- 30+/- 25
Impedance control≥50ohms+/-10%+/-10%-/-8%
<50ohms5 Ω5 Ω4 Ω
Min LW/S (Inner)@1oz base Cu ( mil )3.0 / 3.02.6 / 2.62.5 / 2.5
Min LW/S (Outer)@1oz Cu ( mil )3.5 / 3.53.0 / 3.53.0 / 3.0
Max dimple for POFV ( um )302015
Surface FinishingENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au

 

Packaging & Delivery
Packaging Details:Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.
Port:Shenzhen or Hongkong
Lead Time:Quantity(Pieces)1-1011-100101-1000>1000
 Est. Time(days)202125To be negotiated

 

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

 

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

 

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

 

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

 

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

 

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

 

Product Tags: High Density Pcbs Multi Layer 2.0mm   Multi Layer Printed Circuit Boards 2.0mm   2.0mm High Density Pcbs Multi Layer  
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