3 Oz Copper Special PCB Bonding Process

Browse Categories

Quanhong FASTPCB

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86--18820288062

Contact Person:
Mr.Yu View Contact Details

3 Oz Copper Special PCB Bonding Process

Minimum Order Quantity	10PCS
Price	USD 0.01-100PCS
Supply Ability	10PCS+48Hour(production time )
Packaging Details	Corrugated case
PCB	Bonding Process Printed Circuit Board
Base Material	FR-4
Number Of Layers	6 Layer
Board Thickness	1.2mm
Min. Hole Size	0.20mm
Min. Line Width	0.075mm
Min. Line Spacing	0.075mm
Solder Mask Color	Green
Surface Treatment	Immersion Gold
Application Area	bonding products

Detailed Product Description

Bonding Process Printed Circuit Board

Bonding special process printed circuit board is a special process printed circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd., which is made of FR-4 material and surface gold deposition. The minimum line width and line spacing can reach 75 / 75um and the minimum aperture can reach 0.2mm. The circuit board is widely used in mobile phones, laptops, automobiles, tablet computers and other fields.

Technology Roadmap

Item		HLC Advanced Technology
Item		2019	2020	2021
Max Panel Width (inch)		25	25	25
Max Panel Length (inch)		29	29	29
Max Layer Count (L)		16	18	36
Max Board thickness (mm)		3.2	4	6
Max Board thickness Tolerance		+/-10%	+/-10%	+/-10%
Base copper Thickness	Inner layer ( OZ )	4	6	8
Base copper Thickness	Outer Layer ( OZ )	2	3	4
Min DHS ( mm )		0.2	0.15	0.15
PTH Size Tolerance ( mil )		+/-2	+/-2	+/-2
Back Drill (stub)( mil )		~ 3	~ 2.4	~ 2
Max. AR		12:1	16:1	20:1
Item		HLC Advanced Technology
Item		2019	2020	2021
M-drill tolerance	Inner layer ( mil )	DHS + 10	DHS + 10	DHS + 8
M-drill tolerance	Outer Layer ( mil )	DHS + 8	DHS + 8	DHS + 6
Solder mask Registration (um)		+/- 40	+/- 30	+/- 25
Impedance control	≥50ohms	+/-10%	+/-10%	-/-8%
Impedance control	<50ohms	5 Ω	5 Ω	4 Ω
Min LW/S (Inner)@1oz base Cu ( mil )		3.0 / 3.0	2.6 / 2.6	2.5 / 2.5
Min LW/S (Outer)@1oz Cu ( mil )		3.5 / 3.5	3.0 / 3.5	3.0 / 3.0
Max dimple for POFV ( um )		30	20	15
Surface Finishing		ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au

Packaging & Delivery
Packaging Details:	Inner: vacuum packing or Anti-static package, Outer: export carton or according to the customer's requirement.
Port:	Shenzhen or Hongkong
Lead Time:	Quantity(Pieces)	1-10	11-100	101-1000	>1000
	Est. Time(days)	20	21	25	To be negotiated

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

Product Tags: pcb 3 oz copper thickness 3 oz copper Special PCB Bonding bonding pcb

Related Products

Tg170 Tg180 Fr4 Copper Clad Special PCB ENIG OSP Selective Surface for sale


From:	Enter your Email please. Your email is incorrect!
To:	Quanhong FASTPCB
Subject:	Subject is empty!
Message:	Characters Remaining: (80/3000) Please enter 20 to 3000 characters to contact this supplier!

3 Oz Copper Special PCB Bonding Process

3 Oz Copper Special PCB Bonding Process

Bonding Process Printed Circuit Board

Tg170 Tg180 Fr4 Copper Clad Special PCB ENIG OSP Selective Surface

4 Layer Special PCB 1.6 Mm 94v0 Fr-4 Pcb Board Half Hole Module

6 Layer Special PCB Printed Circuit Board Fr-4 Optical Fiber Module

High Density Pcb Multi Layer Printed Circuit Board 2.0mm

HLC High Layer Count Pcb For 5G Era

FR-4 Sy S1000-2 8 Layers Special PCB Motherboard Industrial Control 1.6mm