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polished quartz tube semiconductor
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2025-07-23 00:15:23
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..., ceramics, and semiconductor materials. Specification (1). Dimensions of upper and lower grinding discs (mm): Upper grinding discs Ø973* Ø403*60 ...
2025-03-07 13:31:22
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9B Double Sided Grinding and Polishing Machine This model is mainly used for double-sided high-precision grinding/polishing of optical glass, mobile ...
2025-03-07 13:31:37
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Material COE 3.3 borosilicate glass Main Composition SiO2 80±0.5% B2O3 2.4±0.2% Na2O+K2O 4.3±0.2% Chemical and Physical property Coefficient of ...
2025-07-17 15:26:04
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