High Frequency Rigid Flex Circuit Board FR4 High TG Immersion Tin PCB

High Frequency Rigid Flex Circuit Board FR4 High TG Immersion Tin Pcb

Max layers: 32layer (≥20 layer needs to review)

Max finish panel size: 740* 500 MM(>600 MM needs to review)
PCB material: PI +FR4,FR4, Rogers,Halogen-free, High TG and heavy copper
PCB thickness: 0.2~4.0mm(＜0.2 mm,＞4 mm needs to review)

PCB copper thickness: H~5oz

Min. hole size: 0.15mm(＜0.15 mm needs to review)

Max hole size: 6.0mm(>6mm, use milling to enlarge holes)

HDI Min drill hole: 0.08-0.10MM

Min space in inner layer(one-sided): 4～8L(include): sample: 4 mil; small volume: 4.5 mil;

8~12L(include): sample: 5 mil; small volume: 5.5 mil

12～18L(include): sample: 6 mil; small volume: 6.5 mil

PCB solder mask: Green, Matt green,Blue, Matt blue, Black, Matt black, Yellow, Red, White,etc
PCB silkscreen: White, Black, etc
PCB surface: HASL lead free,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger

Application: Communications, Industry/comsumer Electronic.

Quick turn PCB manufacturing (2layer 24hours, 4layer 48hours…. Fastest )

FR4 , Aluminum, Flexible, Rogers, Teflon PCB mass production

Multi-Layered PC Board (4-32 layers)

Low to high volume surface mount and through-hole PCB assembly

01005s, BGA, uBGA, CCGA CSP and Flip Chip

0.4mm Fine Pitch Devices

Prototype and pre-production electronic assembly

Surface Mount Technology (Paste and Epoxy)

Encapsulation and conformal coating of PCB assemblies

Lead-Free assembly

Intrusive reflow

Press fit

Wave/Selective wave soldering

Double/Single-sided reflow processing

Rework and repairs (Fine Pitch QFP, Area Array Packages)

Functional, electrical, and in-circuit testing

By managing the end-to-end production process, we enable our customers to concentrate on their core specialties.