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pyroelectric free linbo3 substrate
Selling leads
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.... Typical cut angle for SAW application is 36°Y, 42°Y, X-cut etc. The Lithium Tantalate reduction technology makes the wafer “black” and free of ...
2024-12-09 20:34:25
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.... Typical cut angle for SAW application is 36°Y, 42°Y, X-cut etc. The Lithium Tantalate reduction technology makes the wafer “black” and free of ...
2024-12-09 20:34:25
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... and, to a different specification, for optical use. Wafers can be produced with varying properties, such as "black" wafers free of pyroelectric ...
2024-12-09 20:34:25
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...r specific requirements are met by choosing prime grade and defecting free silicon wafer as a substrate so that a high uniform layer of thermal ...
2025-08-03 00:13:22
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