1oz 2oz 3oz FPC Printed Circuit Board Assembly ISO9001

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Shenzhen Senyan Circuit Co., Ltd.

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-26644463

Contact Person:
Miss.Lexie View Contact Details

1oz 2oz 3oz FPC Printed Circuit Board Assembly ISO9001

Brand Name	SenYan
Model Number	FPC circuit board
Certification	ISO14001,ISO13485,ISO9001,IATF16949
Place of Origin	China
Minimum Order Quantity	1pcs
Price	Negotiate
Payment Terms	L/C, D/A, D/P, T/T
Supply Ability	100000pcs
Delivery Time	1-30days
Packaging Details	PCB: Vacuum Packing / PCBA: ESD Packing
Name	FPC circuit board
Solder mask	Green
Silk Screen	White
Surface Technics:	HASL-F
Max panel size	32＂×20＂（800mm×508mm）
Layer count	2~18
Copper thickness	1/2OZ 1OZ 2OZ 3OZ
Application	Consumer Electronics

Detailed Product Description

FPC Circuit Board Factory Directly FPC board Manufacturer Flex Pcb board Flexible Printed Circuit Board

Component Assembly - The service mount capability and trough hole that this design offers is a remarkable electrostatic and protective packaging.

Air Gap - The technology of flexible circuits rapidly increased the flexibility that is mainly achieved by layers with one main advantage “unbinding”. This is an essential aspect of the flexible circuit assembly, allowing the layer to freely flex.

Controlled Impedance - is responsible for increasing the signal switching speeds used transmission lines. Today’s designs is increasing the speed and minimizing the electrical reflections. It's help to ensure no errors between the transitions and the track interconnections. On the other hand, a perfectly designed and optimized controlled impedance can allow great control of the material of the cable and its physical dimensions. The controlled impedance in order to uniform in both thickness and electrical properties that is not a barrier for the industry.

Penalization - allows the circuit to be durable in components assembly. Once the panel is completed the circuit is ready for the end product.

Pressure Sensitive Adhesives (PSAs) - are used in projects and applications that a portion of the circuit has to be extra secured to a specific condition or location in the end product. The assembly process includes a releasing of the abradant liner and the adhesive with remains exposed is allowing the manufacturer to press the circuit in its place and keep it durable for use.

Shielding - when there is a demand to limit electrostatic and electromagnetic interferences that securing is applied.
The shielding can be solid or electromagnetic. Both of the materials are insulating signal lines and any noise.

Manufacturing of Flexible Printed Circuit Board

___________________________________________

FPC is usually created by a photolithographic one sheet a time, also more efficient way is adopting R oll T o R oll ( RTR ).

1. Shearing: Crop the row material.
2. Computer Numerical Control (CNC): CNC is the drilling process.
3. Plating hole: Plate copper on hole.
4. Dry film lamination: create an etching layer of resistance.
5. Exposure: create an exposure area.
6. Development:The exposure area is polymerized and hardened by UV-rays.
7. Etching:remove the non-exposure area by chemical reaction.
8. Stripping:circuit pattern exposed.
9. Automated Optical Inspection (AOI):checks the quality of the printed board.
10. Coverlay pre-lamination:the board is covered with an insulation layer called “overlay”.
11. Hotpress:Bond between the overlay and the copper layer.
12. Metal finish: Coated to protect the terminal function.
13.Test: test the finished design.

With Large Monthly Production Capacity
With the help of our 15 CAM engineers, 15 SMT machine engineers and 10 BOM analysis engineers, our PCB production capacity can reach 40,000 square meters and EMS assembly capacity at 150 million components per month. Moreover, our reliable world-famous brand component procurements are as follows:

Global procurement database
Distribution partnership
Flexible stocking programs
Integrated customer registered pricing
Extensive global supply chain
OEM sourcing agreements

SMT Manufacturing Capability

SMT Manufacturing Capability
Item		Manufacturing Capability in process	Manufacturing Method
Production size(Min/Max)		50×50mm / 500×500mm
Production board thickness		0.2 ～ 4mm
Printing solder paste	Support method		Magnetism fixture, vacuo platform
	Clamping method		Sticking up by vacuo, clamping on both sides ,flexible clamping with sheet, flexible clamping with thick board
	Cleaning Method of printing solder paste		Dry method+ wetting method+ Vacuo method
	Accuracy of printing	±0.025mm
SPI	Repeated accuracy of volume	<1% at 3σ
Mounting component	Components size	0603(Option) L75mm Connector
	Pitch	0.15mm
	Repeated accuracy	±0.01mm
AOI	FOV size	61×45mm
AOI	Test speed	9150mm²/Sec
3D X-ray	Shootingangle	0-45

Detail For PCB:

Item	Capability
1.Base Material	FR-4 / High TG FR-4 /Aluminum /CEM-1/Rogers/Arlon/Taconic/Teflon
2.Layers	1-22
3.Finised inner/outer copper thickness	1-6OZ
4.Finished board thickness	0.2-7.0mm
5.Min hole size	Mechanical hole: 0.15mm Laser hole: 0.1mm
6.Controlled Impedance	+/-5%
7.Plugging vias capability	0.2-0.8mm
8.Outline profile	Rout/ V-cut/ Bridge/ Stamp hole
9.Surface treatment	HASL, HASL lead free, Immersion Gold, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP…

1, What service do you have?
We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

2, What is needed for PCB & PCBA quotation?
For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCBA: PCB information, BOM,Testing documents.

3, How to keep our product information and design file secret ?
We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

4, What are the main products of your PCB/PCBA services?
Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

5, What is your minimum order quantity (MOQ)?
Our MOQ is 1 PCS, sample and mass production all can support.

Product Tags: 3oz printed circuit board assembly 2oz printed circuit board assembly ISO9001 printed circuit assembly manufacturing

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1oz 2oz 3oz FPC Printed Circuit Board Assembly ISO9001

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