Metal Bond Diamond Grinding Wheel for Silicon Wafer Edge Grinding

Metal Bond Diamond Grinding Wheel for Silicon Sapphire Wafer Edge Grinding

Metal bond wheels and resin bond wheels are used in edge grinding on the outer circumference of sillicon wafers, which requires uniform sharpness in addition to precision accuracy in the shape of the wheel and abrasion resistance. Both outer-circumference machining and notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing.

2.More production output
3.Extreme wear resistance
4.Wheel sharpness is maintained longer
5.Better heat transfer from the ground material 6.Longer product life cycle