China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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thermal sheet cpu silicone

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1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13
Low Thermal Resistance 0.8W/m.K Thermally Conductive Silicone Encapsulant For Power Battery Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13
...Thermal Conductivity Silicone Encapsulating Low Viscosity For Transformer Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 17:19:13
...Thermal Conductivity Rubber Silicon Gel Liquid Gap Filler​ Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A ... 2024-12-09 17:19:13
Ultra Soft Series 1.0W/m.K 0.5mm Thermal Thermal Silicone Pad For EV Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2024-12-09 17:19:32
Ultra Soft 8.0W/m.K Thermal Conductivity Thermal Pad Material With Blue Silicone Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32
1.4W/m.K Thermal ConductivityYellow Silicone Soft Thermal Insulation Pad For Heat-Sink GPU Attribute Value Test Method Product TC1500B - Composition ... 2024-12-09 17:19:32
...Thermal Insulation Silicone Pad With 1.4 W/m.K Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color ... 2024-12-09 17:19:32
...Thermally Conductive Encapsulant Potting Compound Silicone With OBC Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 22:03:00
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00
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