China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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silicone thermally conductive encapsulant

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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silicone thermally conductive encapsulant

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Low Volatility High Thermal Conductivity Silicone Pad For Industrial Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2024-12-09 17:19:13
1.2W/m.k Thermal Conductive Pad Made Of Ceramic Filler And Silicone Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2024-12-09 17:19:13
Low Volatility High Thermal Conductivity Silicone Pad For Industrial Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2026-04-06 00:29:56
1.2W/m.k Thermal Conductive Pad Made Of Ceramic Filler And Silicone Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2026-04-06 00:29:56
...Thermal Grease 1.0W/m.K Thermal Conductivity Slicone Base Grey Paste For LED Attribute Value Test Method Composition Non-Vulcanized Silicone Oil ... 2024-12-09 17:19:13
...Thermal Grease 1.0W/m.K Thermal Conductivity Slicone Base Grey Paste For LED Attribute Value Test Method Composition Non-Vulcanized Silicone Oil ... 2024-12-09 22:03:00
Green Silicone High Thermal Conductive Pad With 5.0W/m.K For cpu thermal gap filler Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2024-12-09 17:19:13
Green Silicone High Thermal Conductive Pad With 5.0W/m.K For cpu thermal gap filler Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2026-04-06 00:29:56
1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive Attribute Value Test Method Composition Ceramic Filler ... 2024-12-09 17:19:13
1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive Attribute Value Test Method Composition Ceramic Filler ... 2026-04-06 00:29:56
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