China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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silicone thermally conductive encapsulant

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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silicone thermally conductive encapsulant

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1.6W/m.K Thermal Conductivity 0.23mm Thickness Silicone Electrical Insulation Sheet For CPU Typical Properties Properties Attribute Test Method Color ... 2026-04-06 00:29:56
...Thermal Conductivity Silicone Liquid Gap Filler With High Breakdown Voltage Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00
...Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM D2240 Usage Temperature(℃) ... 2024-12-09 17:19:32
...Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM D2240 Usage Temperature(℃) ... 2026-04-06 00:29:56
Thermal Paste CPU Soft Silicone Gel Liquid Gap Filler For Heat Cooler Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 17:19:13
Thermal Paste CPU Soft Silicone Gel Liquid Gap Filler For Heat Cooler Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 22:03:00
Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13
Ultra Soft Thermal Pad High breakdown voltage with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:13
Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13
Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13
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