China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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silicone thermally conductive encapsulant

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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silicone thermally conductive encapsulant

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...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 17:19:13
...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 22:03:00
...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2024-12-09 17:19:13
...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2026-04-06 00:29:56
Silicone Grease Heat Sink Thermal Grease Graphics Desktop Cpu Notebook Cooling Paste Attribute Value Test Method Composition Non-Vulcanized Silicone ... 2024-12-09 17:19:13
...Silicone Heat Sink Thermal Grease For CPU & GPU Support To OEM&ODM Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and ... 2024-12-09 17:19:13
Silicone Grease Heat Sink Thermal Grease Graphics Desktop Cpu Notebook Cooling Paste Attribute Value Test Method Composition Non-Vulcanized Silicone ... 2024-12-09 22:03:00
...Silicone Heat Sink Thermal Grease For CPU & GPU Support To OEM&ODM Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and ... 2024-12-09 22:03:00
TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13
TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56
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