Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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Heatproof Blue Silicone Thermal Pad Anti Insulation Tensile Strength 0.4 KN/M

Blue Silicone Thermal Pads High Temperature Resistance And Non Conductive Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2024-12-09 17:19:13

Durable Silicone Thermal Conductive Pad 10mm Thickness For Telecommunications

10.0mm Thickness Silicone Thermal Conductivity Pad For Telecommunications Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2026-04-06 00:29:56

Heatproof Blue Silicone Thermal Pad Anti Insulation Tensile Strength 0.4 KN/M

Blue Silicone Thermal Pads High Temperature Resistance And Non Conductive Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2026-04-06 00:29:56

Electrical Isolation Non Silicone Thermal Pad

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2024-12-09 17:19:13

Electrical Isolation Non Silicone Thermal Pad

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2024-12-09 22:03:00

Thermal conductive materials Organic Silicone, Thermal Conductive Gap Filler

Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13

Thermal conductive materials Organic Silicone, Thermal Conductive Gap Filler

Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

RoHS Heatproof Non Silicone Thermal Pad , Telecommunication Heat Dissipation Pad

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2024-12-09 17:19:13

RoHS Heatproof Non Silicone Thermal Pad , Telecommunication Heat Dissipation Pad

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2026-04-06 00:29:56

Silicone Thermally Conductive Encapsulant UL94-V0 Flammability For Sensor

...Thermal Conductivity Silicone Encapsulating For Sensor Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White ... 2024-12-09 17:19:13

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