Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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shockproof thermal heat transfer pads

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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shockproof thermal heat transfer pads

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Multipurpose silicone Heat Sink Thermal Pad practical 1.2 W/m.K

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

Multipurpose silicone Heat Sink Thermal Pad practical 1.2 W/m.K

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

Shockproof Antiwear Thermal Conductive Pad Tasteless High Performance

1.4 W/m.K Thermal Conductivity Thermal Insulation Silicone Pad For Power Adapter Attribute Value Test Method Product TC1500B - Composition Silicone + ... 2024-12-09 17:19:32

Shockproof Antiwear Thermal Conductive Pad Tasteless High Performance

1.4 W/m.K Thermal Conductivity Thermal Insulation Silicone Pad For Power Adapter Attribute Value Test Method Product TC1500B - Composition Silicone + ... 2026-04-06 00:29:56

Nontoxic Laptop Thermal Insulation Pad Shockproof Anti Interfere

-40 ℃ ~ 200 ℃ Usage Temperature Thermal Insulation Silicone Pad With 1.4 W/m.K Attribute Value Test Method Product TC1500B - Composition Silicone + ... 2024-12-09 17:19:32

Nontoxic Laptop Thermal Insulation Pad Shockproof Anti Interfere

-40 ℃ ~ 200 ℃ Usage Temperature Thermal Insulation Silicone Pad With 1.4 W/m.K Attribute Value Test Method Product TC1500B - Composition Silicone + ... 2026-04-06 00:29:56

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

Shockproof Heat Sink Thermal Grease Anti Corrosion Multiscene

Silver Heat Sink Thermal Grease For Coolers Heat Sink Composed of Carbon Polysynthetic Attribute Value Test Method Composition Non-Vulcanized Silicone ... 2024-12-09 17:19:13

Shockproof Heat Sink Thermal Grease Anti Corrosion Multiscene

Silver Heat Sink Thermal Grease For Coolers Heat Sink Composed of Carbon Polysynthetic Attribute Value Test Method Composition Non-Vulcanized Silicone ... 2024-12-09 22:03:00

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