China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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sensor thermally conductive encapsulant

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
View Contact Details
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sensor thermally conductive encapsulant

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...Thermally Conductive Encapsulant Potting Compound Silicone With LED Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 17:19:13
...Thermally Conductive Encapsulant Potting Compound Silicone With LED Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 22:03:00
...Thermal Conductivity Silicone Encapsulating For Power Battery Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A ... 2024-12-09 17:19:13
...Thermal Conductivity Silicone Encapsulating For Power Battery Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A ... 2024-12-09 22:03:00
Low Thermal Resistance 0.8W/m.K Thermally Conductive Silicone Encapsulant For Power Battery Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13
...Thermally Conductive Silicone Encapsulant For Led Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White ... 2024-12-09 17:19:13
...Thermally Conductive Silicone Encapsulant For Led Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White ... 2024-12-09 22:03:00
Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13
Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13
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