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rohs thermal pads pcb
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1.2W/m.K Thickness 0.5 mm Thermal Conductive Pad Gap Filling Materials Cooling Pad For Laptop LED Attribute Value Test Method Composition Ceramic ...
2024-12-09 17:19:13
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0.25 mm Thickness Thermal Insulation Pad For Power Supplies With Yellow Fiberglass Carrier Pad Attribute Value Test Method Product TC1500B - ...
2024-12-09 17:19:32
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1.2W/m.K Thickness 0.5 mm Thermal Conductive Pad Gap Filling Materials Cooling Pad For Laptop LED Attribute Value Test Method Composition Ceramic ...
2025-01-02 00:10:25
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0.25 mm Thickness Thermal Insulation Pad For Power Supplies With Yellow Fiberglass Carrier Pad Attribute Value Test Method Product TC1500B - ...
2025-01-02 00:10:25
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1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ...
2024-12-09 17:19:13
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High Breakdown Voltage Thermal Conductivity Silicone Encapsulating For Electric Machinery Attribute Value Test Method Composition Ceramic filler + ...
2024-12-09 17:19:13
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1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ...
2024-12-09 22:03:00
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High Breakdown Voltage Thermal Conductivity Silicone Encapsulating For Electric Machinery Attribute Value Test Method Composition Ceramic filler + ...
2024-12-09 22:03:00
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1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive Attribute Value Test Method Composition Ceramic Filler ...
2024-12-09 17:19:13
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10.0mm Thickness Silicone Thermal Conductivity Pad For Telecommunications Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ...
2024-12-09 17:19:13
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