Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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rohs thermal pad material

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UL Certification Electronic Heatsink Thermal Pad , 1.2W Silicone Heat Transfer Pad

1.2W/m.K Pink Thermal Conductivity Silicone Pad For Electronic Product Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2026-04-06 00:29:56

AOK Tasteless Heat Sink Silicone Pad, Heatproof Electrically Conductive Thermal Pad

0.25mm Thickness High Breakdown Voltage Thermal Insulation Silicone Pad For Inverter Attribute Value Test Method Product TC1500B - Composition ... 2026-04-06 00:29:56

Multipurpose silicone Heat Sink Thermal Pad practical 1.2 W/m.K

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

Multipurpose silicone Heat Sink Thermal Pad practical 1.2 W/m.K

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

Multipurpose Heat Sink Thermal Pad

Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 ... 2024-12-09 17:19:13

Multipurpose Heat Sink Thermal Pad

Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 ... 2024-12-09 22:03:00

Thermal conductive materials Organic Silicone, Thermal Conductive Gap Filler

Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13

Thermal conductive materials Organic Silicone, Thermal Conductive Gap Filler

Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

Thickness 0.23mm Electrical Insulation Sheet Anticorrosive Thermal Pad For CPU

1.6W/m.K Thermal Conductivity 0.23mm Thickness Silicone Electrical Insulation Sheet For CPU Typical Properties Properties Attribute Test Method Color ... 2024-12-09 17:19:13

Thickness 0.23mm Electrical Insulation Sheet Anticorrosive Thermal Pad For CPU

1.6W/m.K Thermal Conductivity 0.23mm Thickness Silicone Electrical Insulation Sheet For CPU Typical Properties Properties Attribute Test Method Color ... 2026-04-06 00:29:56

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