China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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rohs thermal isolation pads

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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rohs thermal isolation pads

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Thermal Conductive Pad with 1.5W/m.K High cut through resistance Low volatility gap filler Attribute Value Test Method Composition Ceramic Filler + ..... 2024-12-09 17:19:13
0.25 mm Thickness Thermal Insulation Pad For Power Supplies With Yellow Fiberglass Carrier Pad Attribute Value Test Method Product TC1500B - ... 2024-12-09 17:19:32
Wholesale Customized Silicone Insulation Material Yellow Thermal Insulation Pad For PCB Attribute Value Test Method Product TC1500B - Composition ... 2024-12-09 17:19:32
Thermal Conductive Pad with 1.5W/m.K High cut through resistance Low volatility gap filler Attribute Value Test Method Composition Ceramic Filler + ..... 2025-01-02 00:10:25
0.25 mm Thickness Thermal Insulation Pad For Power Supplies With Yellow Fiberglass Carrier Pad Attribute Value Test Method Product TC1500B - ... 2025-01-02 00:10:25
Wholesale Customized Silicone Insulation Material Yellow Thermal Insulation Pad For PCB Attribute Value Test Method Product TC1500B - Composition ... 2025-01-02 00:10:25
8.0 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Network Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32
8.0 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Network Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25
TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13
1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive Attribute Value Test Method Composition Ceramic Filler ... 2024-12-09 17:19:13
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