China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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rohs thermal interface material pad

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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rohs thermal interface material pad

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High Electrical Insulation One Side Adhesive Thermal Electrical Insulation Sheet Typical Properties Properties Attribute Test Method Color Pink Visual ... 2024-12-09 17:19:13
High Electrical Insulation One Side Adhesive Thermal Electrical Insulation Sheet Typical Properties Properties Attribute Test Method Color Pink Visual ... 2025-01-02 00:10:25
Low Thermal Resistance 1.4W/m.K Thermal Insulation Silicone Pad Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass ... 2024-12-09 17:19:32
Low Thermal Resistance 1.4W/m.K Thermal Insulation Silicone Pad Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass ... 2025-01-02 00:10:25
...Thermal Pad Material For Power Modules Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 ... 2024-12-09 17:19:32
...Thermal Pad Material For Power Modules Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 ... 2025-01-02 00:10:25
8.0 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Network Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32
8.0 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Network Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25
1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13
1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2025-01-02 00:10:25
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