Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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practical heatsink cooling pad

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Antiwear Thermal Insulation Pad PCB Anti Insulation Practical

Wear-resistan Yellow Silicone thermal sheet Thermal Insulation Pad Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass ... 2024-12-09 17:19:32

Multipurpose silicone Heat Sink Thermal Pad practical 1.2 W/m.K

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

0.5mm Thickness Conductive Silicone Pad Heat Sink Ultrasoft Practical

0.5mm Thickness Withstand Voltage And Insulation Thermal Conductive Silicone Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

Practical Thick Thermal Transfer Pad 45 Shore OO Hardness Multipurpose

Green 2.0W/m.K 45 Shore OO Hardness Silicone Free Thermal Pad For Silicon Sensitive Components Attribute Value Test Method Composition Acrylate - ... 2026-04-06 00:29:56

Multipurpose 3mm Thermal Pad For GPU SSD Practical Ultra Thin

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2026-04-06 00:29:56

Antiwear Thermal Insulation Pad PCB Anti Insulation Practical

Wear-resistan Yellow Silicone thermal sheet Thermal Insulation Pad Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass ... 2026-04-06 00:29:56

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

Ultrasoft Multiscene Thermal Heat Pads Electronics Anti Interfere

2W/m.k Green Silicone Free Thermal Pad For Server Cooling With 45 Hardness Attribute Value Test Method Composition Acrylate - Color Green Visual ... 2024-12-09 17:19:13

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13

RoHS 2.5 KN/M Thermal Isolation Pads GPU 3 mm Weather Resistant

1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13

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