China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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practical heatsink cooling pad

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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practical heatsink cooling pad

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Wear-resistan Yellow Silicone thermal sheet Thermal Insulation Pad Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass ... 2024-12-09 17:19:32
TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25
0.5mm Thickness Withstand Voltage And Insulation Thermal Conductive Silicone Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25
Green 2.0W/m.K 45 Shore OO Hardness Silicone Free Thermal Pad For Silicon Sensitive Components Attribute Value Test Method Composition Acrylate - ... 2025-01-02 00:10:25
Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2025-01-02 00:10:25
Wear-resistan Yellow Silicone thermal sheet Thermal Insulation Pad Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass ... 2025-01-02 00:10:25
TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13
2W/m.k Green Silicone Free Thermal Pad For Server Cooling With 45 Hardness Attribute Value Test Method Composition Acrylate - Color Green Visual ... 2024-12-09 17:19:13
Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13
1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13
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