China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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practical electrical insulation sheet

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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practical electrical insulation sheet

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0.5mm Ultra Soft High Breakdown Voltage 1.0W/m.K Thermal Silicone Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2024-12-09 17:19:32
Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 ... 2024-12-09 17:19:32
TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25
1.2W/m.K Thermal Conductivity Silicone Soft Thermal Conductive Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2025-01-02 00:10:25
Single Part Silicone Thermal Conductive Gap Filler With Room Temperature Curing Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00
1.0mm Thickness Blue Silicon Free Thermal Pad 2W/m.K With Silicone Free Gap Filler Pad Attribute Value Test Method Composition Acrylate - Color Blue ... 2025-01-02 00:10:25
Green 2.0W/m.K 45 Shore OO Hardness Silicone Free Thermal Pad For Silicon Sensitive Components Attribute Value Test Method Composition Acrylate - ... 2025-01-02 00:10:25
Black Thermally Conductive Encapsulant Transparent Silicone Encapsulant For LED Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00
Waterproof Thermally Conductive Encapsulant Silicone Sealant For Led Encapsulation Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00
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