China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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pcb thermal insulation pad

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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pcb thermal insulation pad

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Thermal Conductive Pad with 1.5W/m.K High cut through resistance Low volatility gap filler Attribute Value Test Method Composition Ceramic Filler + ..... 2024-12-09 17:19:13
Thermal Conductive Pad with 1.5W/m.K High cut through resistance Low volatility gap filler Attribute Value Test Method Composition Ceramic Filler + ..... 2026-04-06 00:29:56
High Electrical Insulation One Side Adhesive Thermal Electrical Insulation Sheet Typical Properties Properties Attribute Test Method Color Pink Visual ... 2024-12-09 17:19:13
1.6W/m.K Thermal Conductivity 0.23mm Thickness Silicone Electrical Insulation Sheet For CPU Typical Properties Properties Attribute Test Method Color ... 2024-12-09 17:19:13
High Electrical Insulation One Side Adhesive Thermal Electrical Insulation Sheet Typical Properties Properties Attribute Test Method Color Pink Visual ... 2026-04-06 00:29:56
1.6W/m.K Thermal Conductivity 0.23mm Thickness Silicone Electrical Insulation Sheet For CPU Typical Properties Properties Attribute Test Method Color ... 2026-04-06 00:29:56
8W/m.K Thermal Conductivity Pink Silicone Soft Thermal Pad Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2024-12-09 17:19:32
8W/m.K Thermal Conductivity Pink Silicone Soft Thermal Pad Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2026-04-06 00:29:56
TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13
1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive Attribute Value Test Method Composition Ceramic Filler ... 2024-12-09 17:19:13
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