China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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odorless soft thermal pads

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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odorless soft thermal pads

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Attribute Value Test Method Composition Acrylate - Color Green Visual Thickness(mm) 0.5-10.0 ASTM D374 Density(g/cc) 2.9 ASTM D792 Hardness(shore oo) ... 2025-01-02 00:10:25
Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 ... 2025-01-02 00:10:25
Blue Silicone Thermal Pads High Temperature Resistance And Non Conductive Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2024-12-09 17:19:13
Die Cutting Blue 0.5 mm Thickness Thermal Silicone Pad Material With 8.0 W/m.K Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32
Blue Silicone Thermal Pads High Temperature Resistance And Non Conductive Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2025-01-02 00:10:25
Die Cutting Blue 0.5 mm Thickness Thermal Silicone Pad Material With 8.0 W/m.K Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25
...thermal sheet Thermal Insulation Pad for power modules Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - ... 2024-12-09 17:19:32
...thermal sheet Thermal Insulation Pad for power modules Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - ... 2025-01-02 00:10:25
Green Silicone High Thermal Conductive Pad With 5.0W/m.K For cpu thermal gap filler Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2024-12-09 17:19:13
Green Silicone High Thermal Conductive Pad With 5.0W/m.K For cpu thermal gap filler Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2025-01-02 00:10:25
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