Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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nontoxic thermally conductive interface pads

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Multiscene Thermal Sheet CPU, Nontoxic Ultra Soft Heating Pad

Features High performance film Excellent electrical insulation properties Flammability UL 94 V-0 Low thermal resistance Typical Applications Power ... 2024-12-09 17:19:13

Multiscene Thermal Sheet CPU, Nontoxic Ultra Soft Heating Pad

Features High performance film Excellent electrical insulation properties Flammability UL 94 V-0 Low thermal resistance Typical Applications Power ... 2024-12-09 22:03:00

Ultrasoft Heatproof PC Thermal Pad , 1W Gap Pad Thermal Conductivity

Ultra Soft Low Resistance 1.0W/m.K Thermal Conductivity Silicon Thermal Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32

Ultrasoft Heatproof PC Thermal Pad , 1W Gap Pad Thermal Conductivity

Ultra Soft Low Resistance 1.0W/m.K Thermal Conductivity Silicon Thermal Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2026-04-06 00:29:56

Shockproof Antiwear Thermal Conductive Pad Tasteless High Performance

...Thermal Conductivity Thermal Insulation Silicone Pad For Power Adapter Attribute Value Test Method Product TC1500B - Composition Silicone + ... 2024-12-09 17:19:32

Shockproof Antiwear Thermal Conductive Pad Tasteless High Performance

...Thermal Conductivity Thermal Insulation Silicone Pad For Power Adapter Attribute Value Test Method Product TC1500B - Composition Silicone + ... 2026-04-06 00:29:56

Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material

8 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Wireless Charger Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32

Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material

8 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Wireless Charger Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

Durable Heat Dissipation Pad, Nontoxic Thermal Pad Replacement GPU

Yellow Silicone thermal sheet Thermal Insulation Pad for power modules Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass ... 2024-12-09 17:19:32

Durable Heat Dissipation Pad, Nontoxic Thermal Pad Replacement GPU

Yellow Silicone thermal sheet Thermal Insulation Pad for power modules Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass ... 2026-04-06 00:29:56

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