Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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nontoxic thermal pad for electronics

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Nontoxic Laptop Thermal Insulation Pad Shockproof Anti Interfere

-40 ℃ ~ 200 ℃ Usage Temperature Thermal Insulation Silicone Pad With 1.4 W/m.K Attribute Value Test Method Product TC1500B - Composition Silicone + ... 2024-12-09 17:19:32

Nontoxic Laptop Thermal Insulation Pad Shockproof Anti Interfere

-40 ℃ ~ 200 ℃ Usage Temperature Thermal Insulation Silicone Pad With 1.4 W/m.K Attribute Value Test Method Product TC1500B - Composition Silicone + ... 2026-04-06 00:29:56

Multiscene Thermal Sheet CPU, Nontoxic Ultra Soft Heating Pad

Features High performance film Excellent electrical insulation properties Flammability UL 94 V-0 Low thermal resistance Typical Applications Power ... 2024-12-09 17:19:13

Multiscene Thermal Sheet CPU, Nontoxic Ultra Soft Heating Pad

Features High performance film Excellent electrical insulation properties Flammability UL 94 V-0 Low thermal resistance Typical Applications Power ... 2024-12-09 22:03:00

Multiscene Grey Heat Sink Pad For Laptop Nontoxic Anti Vibration

0.25 mm Thickness Grey 1.4 W/m.K Thermal Insulation Silicone Pad For Power Battery Attribute Value Test Method Product TC1500B - Composition Silicone ... 2024-12-09 17:19:32

Multiscene Grey Heat Sink Pad For Laptop Nontoxic Anti Vibration

0.25 mm Thickness Grey 1.4 W/m.K Thermal Insulation Silicone Pad For Power Battery Attribute Value Test Method Product TC1500B - Composition Silicone ... 2026-04-06 00:29:56

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

1.2 W/m.K Ultra Soft Thermal Conductive Pad 10mm Thickness For Electronics

1.2 W/m.k Thermal Conductivity 10.0 mm Thickness Ultra Soft Thermal Conductive Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

1.2 W/m.K Ultra Soft Thermal Conductive Pad 10mm Thickness For Electronics

1.2 W/m.k Thermal Conductivity 10.0 mm Thickness Ultra Soft Thermal Conductive Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

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