China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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multiscene thermal paste pad

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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multiscene thermal paste pad

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Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 ... 2025-01-02 00:10:25
Ultra Soft Thermal Pad for for heat conduction of LED with 1.0W/m.K gap filler Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:13
Pink Silicon Ultra Soft Thermal Pad Cooling Gap Filling Materials For Notebooks Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32
Ultra Soft Thermal Pad low permeability oil gap filler with 1.0W/m.K Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2024-12-09 17:19:32
Pink Silicone Low Oil Permeability Thermal Pad Material For Telecom Device Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2024-12-09 17:19:32
Ultra Soft Thermal Pad for for heat conduction of LED with 1.0W/m.K gap filler Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2025-01-02 00:10:25
Pink Silicon Ultra Soft Thermal Pad Cooling Gap Filling Materials For Notebooks Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2025-01-02 00:10:25
Ultra Soft Thermal Pad low permeability oil gap filler with 1.0W/m.K Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2024-12-09 22:03:00
Pink Silicone Low Oil Permeability Thermal Pad Material For Telecom Device Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2025-01-02 00:10:25
8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2024-12-09 17:19:32
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