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multiscene thermal pad material
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TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ...
2024-12-09 17:19:13
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TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ...
2026-04-06 00:29:56
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Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 ...
2024-12-09 17:19:13
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Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 ...
2024-12-09 22:03:00
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Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle Attribute Value Test Method Composition Ceramic filler + ...
2024-12-09 17:19:13
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Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle Attribute Value Test Method Composition Ceramic filler + ...
2024-12-09 22:03:00
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1.6W/m.K Thermal Conductivity 0.23mm Thickness Silicone Electrical Insulation Sheet For CPU Typical Properties Properties Attribute Test Method Color ...
2024-12-09 17:19:13
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1.6W/m.K Thermal Conductivity 0.23mm Thickness Silicone Electrical Insulation Sheet For CPU Typical Properties Properties Attribute Test Method Color ...
2026-04-06 00:29:56
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High Thermal Conductivity High Electrical Insulation Pink Thermal Pad Material Attribute Value Test Method Composition Ceramic Filler + Silicone - ...
2024-12-09 17:19:32
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High Thermal Conductivity High Electrical Insulation Pink Thermal Pad Material Attribute Value Test Method Composition Ceramic Filler + Silicone - ...
2026-04-06 00:29:56
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